KLA-Tencor Announces Two Additions to Litho/Etch Process Control Portfolio
New metrology and inspection tools facilitate advanced patterning techniques
for manufacturing sub-20nm memory and microprocessor chips
MILPITAS, Calif., Feb. 25, 2013
MILPITAS, Calif., Feb. 25, 2013 /PRNewswire/ -- At the SPIE Advanced
Lithography conference, KLA-Tencor Corporation (NASDAQ: KLAC) announced its
SpectraShape™ 9000 optical critical dimension (CD) metrology system and
BDR300™ backside defect inspection and review module. The SpectraShape 9000 is
a new metrology system capable of monitoring the shapes of three-dimensional
transistors, memory cells and other key structures that enable
high-performance memory and microprocessor chips. The BDR300 inspects and
reviews the back side of the wafer for defects that can cause patterning
problems on the wafer's front side. The two new systems are designed to enable
volume production of integrated circuits at sub-20nm design rules.
"In this era of highly extended 193nm immersion lithography, our customers are
innovating on several fronts to deal with process tolerances in lithography
and etch that have become remarkably tight," said Brian Trafas, Ph.D., chief
marketing officer at KLA-Tencor. "The two products we have launched today
tackle two key process control issues in this area: scanner focus-related
defects and failure or underperformance of finFETs, vertically stacked NANDs,
and other three-dimensional structures, caused by small deviations in shape.
The BDR300 and SpectraShape 9000 are designed to help our customers navigate
the monumental challenges they are facing today in lithography and etch."
The new SpectraShape 9000 introduces a laser-driven plasma light source and
several other significant advances that enable leading-edge dimensional
metrology capability for a broad range of materials and structures. The
SpectraShape 9000 features higher sensitivity and throughput than its
predecessor in order to accommodate the industry's need for tighter process
control at sub-20nm nodes—a need to measure more sites per wafer on an
increasing number of layers. It also supports innovative metrology targets
designed for multiple-patterning lithography.
The new BDR300 back-side inspection and review module for the CIRCL™ cluster
tool features a dramatic improvement in defect sensitivity over that of its
predecessor, allowing fabs to find and classify sub-micron back-side defects,
which can agglomerate and affect yield at advanced nodes. The CIRCL cluster is
now available as a stand-alone back-side inspection and review system, a
configuration designed to support an increasing industry requirement to
inspect the back sides of wafers before wafers enter the scanner. Clean wafer
back sides reduce the probability of contaminating the scanner chuck and
affecting subsequent product.
Multiple SpectraShape 9000 shape metrology systems have been installed at
leading logic and memory chip manufacturers, where they are replacing existing
CD/shape metrology tools for new technology development and ramp or fulfilling
requirements for additional metrology capacity. The first CIRCL tools
containing the BDR300 module have also been installed and are being used for
proactive scanner monitoring as well as traditional after-develop defect
inspection. To maintain the high performance and productivity demanded by
leading-edge production, the SpectraShape and CIRCL tools are backed by
KLA-Tencor's global, comprehensive service network.
More information on the SpectraShape 9000 system can be found on the
SpectraShape product web page. For more information on the BDR300 module or
the CIRCL system, please visit the CIRCL product web page.
KLA-Tencor Corporation, a leading provider of process control and yield
management solutions, partners with customers around the world to develop
state-of-the-art inspection and metrology technologies. These technologies
serve the semiconductor, LED and other related nanoelectronics industries.
With a portfolio of industry-standard products and a team of world-class
engineers and scientists, the company has created superior solutions for its
customers for more than 35 years. Headquartered in Milpitas, Calif.,
KLA-Tencor has dedicated customer operations and service centers around the
world. Additional information may be found at www.kla-tencor.com(KLAC-P).
Forward Looking Statements:
Statements in this press release other than historical facts, such as
statements regarding the SpectraShape 9000's, CIRCL's or BDR300's expected
performance, trends in the semiconductor industry and the anticipated
challenges associated with them, expected uses of the SpectraShape 9000, CIRCL
or BDR300 by KLA-Tencor's customers, expected compatibility of the
SpectraShape 9000, CIRCL or BDR300 with other KLA-Tencor tools, and the
anticipated cost, operational and other benefits realizable by users of the
SpectraShape 9000, CIRCL or BDR300 tools, are forward-looking statements, and
are subject to the Safe Harbor provisions created by the Private Securities
Litigation Reform Act of 1995. These forward-looking statements are based on
current information and expectations, and involve a number of risks and
uncertainties. Actual results may differ materially from those projected in
such statements due to various factors, including delays in the adoption of
new technologies (whether due to cost or performance issues or otherwise), the
introduction of competing products by other companies or unanticipated
technological challenges or limitations that affect the implementation,
performance or use of KLA-Tencor's products.
SOURCE KLA-Tencor Corporation
Contact: Investor Relations, Ed Lockwood, Sr. Director, Investor Relations,
+1-408-875-9529, email@example.com, or Media Relations, Meggan
Powers, Sr. Director, Corporate Communications, +1-408-875-8733,
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