Rudolph to Participate in UBS SMID Cap One-on-One Symposium Business Wire FLANDERS, N.J. -- February 25, 2013 Rudolph Technologies, Inc. (NASDAQ: RTEC) today announced that the Company’s management will participate in the UBS SMID Cap One-on-One Symposium, to be held February 26, 2013 in Boston, MA. Paul McLaughlin, Chairman and CEO, will provide an overview of the Company and will discuss its competitive position and future prospects. For more information about the UBS Symposium or to schedule a one-on-one meeting with Rudolph Technologies’ management, please contact your UBS representative directly. About Rudolph Technologies Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s expanding portfolio of equipment and software solutions is used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com. Contact: Rudolph Technologies Investors: Laura Guerrant-Oiye, 808-882-1467 firstname.lastname@example.org or Trade Press: Virginia Becker, 952-259-1647 email@example.com
Rudolph to Participate in UBS SMID Cap One-on-One Symposium
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