Rudolph to Participate in UBS SMID Cap One-on-One Symposium

  Rudolph to Participate in UBS SMID Cap One-on-One Symposium

Business Wire

FLANDERS, N.J. -- February 25, 2013

Rudolph Technologies, Inc. (NASDAQ: RTEC) today announced that the Company’s
management will participate in the UBS SMID Cap One-on-One Symposium, to be
held February 26, 2013 in Boston, MA. Paul McLaughlin, Chairman and CEO, will
provide an overview of the Company and will discuss its competitive position
and future prospects.

For more information about the UBS Symposium or to schedule a one-on-one
meeting with Rudolph Technologies’ management, please contact your UBS
representative directly.

About Rudolph Technologies
Rudolph Technologies, Inc. is a worldwide leader in the design, development,
manufacture and support of defect inspection, advanced packaging lithography,
process control metrology, and data analysis systems and software used by
semiconductor device manufacturers worldwide. Rudolph provides a full-fab
solution through its families of proprietary products that provide critical
yield-enhancing information, enabling microelectronic device manufacturers to
drive down the costs and time to market of their products. The Company’s
expanding portfolio of equipment and software solutions is used in both the
wafer processing and final manufacturing of ICs, and in adjacent markets such
as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports
its customers with a worldwide sales and service organization. Additional
information can be found on the Company’s website at www.rudolphtech.com.

Contact:

Rudolph Technologies
Investors:
Laura Guerrant-Oiye, 808-882-1467
lguerrant@guerrantir.com
or
Trade Press:
Virginia Becker, 952-259-1647
virginia.becker@rudolphtech.com
 
Press spacebar to pause and continue. Press esc to stop.