NXP Strengthens SmartMX2 Security Chips With PUF Anti-Cloning Technology

NXP Strengthens SmartMX2 Security Chips With PUF Anti-Cloning Technology 
Licensing Contract With Intrinsic-ID Increases NXP's Security
Leadership 
EINDHOVEN, THE NETHERLANDS -- (Marketwire) -- 02/21/13 --   NXP
Semiconductors N.V (NASDAQ: NXPI) today announced that it will be the
first company to bring to market smartcard and embedded secure
element chips that integrate Intrinsic-ID's industry-leading PUF
(Physically Unclonable Function) technology. PUFs are an innovative
way of safeguarding individual chips from data theft by using the
unique 'fingerprint' inherent in every semiconductor device to
protect its encryption key, making it very hard to clone and thus
reverse-engineer and compromise security microcontrollers.  
Global trends such as urbanization, digitization of governmental
documents, improved banking security and growing NFC adoption means
that security chips are being adopted more than ever to protect user
data, credentials and finances. In parallel, more sophisticated
attacks have been developed that attempt to undermine security chip
functionality and steal this information. By integrating
Intrinsic-ID's PUF technology into its secure microcontroller
SmartMX2, NXP significantly enhances the chip's security architecture
and strengthens applications such as NFC-enabled mobile payment,
electronic ticketing, and eGovernment and cyber security services. 
"Concerns about smartcard security have increased with the wide
availability of sophisticated tools and invasive techniques to
discover the secrets and keys that traditionally protect devices from
counterfeiting, tampering and theft-of-data," said Pim Tuyls, CEO at
Intrinsic-ID. "We believe that our PUF technology is ideally suited
to helping to overcome this problem, particularly when combined with
NXP's industry-leading secure IC solutions." 
"The use of smartcard and smartcard-type functionality in NFC-enabled
phones is becoming increasingly popular around the world. But for
many users, security doubts still linger -- providing the highest
level of security for eID cards, banking cards or NFC smart phones is
thus essential," said Ruediger Stroh, EVP and general manager,
Identification business with NXP Semiconductors. "Adding PUF
technology to SmartMX2 chips helps to alleviate user doubts as we
bring more security and trust to smart life solutions and provide our
customers with a key competitive edge. As such, we're very happy to
have entered into this contract with Intrinsic-ID, the undisputed
leader in PUF." 
SmartMX and PUF technology
 Intrinsic-ID's PUF technology is
currently being integrated into future generations of SmartMX2
security chips. The SmartMX2 is the world's first security
microcontroller with a Common Criteria EAL 6+ certificate issued by
the German Federal Office for Information Security (BSI). Its
IntegralSecurity(TM) architecture comes with more than 100 different
security features protecting it against reverse engineering,
semi-invasive and non-invasive attacks. Adding PUF technology
significantly improves the chip's protection from reverse engineering
attacks, as it removes the permanent presence of the digital
encryption key on the device.  
PUFs rely on the physical characteristics of SRAM (static
random-access memory) technology. After powering up a secure element,
the used cells are initialized randomly. This start-up behavior --
bits toggling between zero or one -- is different for every
individual chip. As such, this content after start-up can serve as a
unique fingerprint, which can then be used as a key to protect an
encryption key or to protect a memory.  
NXP is the No. 1 supplier to the Identification market globally, and
leverages its leadership in contactless and security technologies to
provide complete Identification solutions. Its trusted smart life
solutions bring security and contactless performance to a wide range
of applications such as eGovernment, banking, mobile transactions,
transport ticketing, access management, infrastructure, device
authentication, RFID tagging and gaming. NXP has shipped almost two
billion SmartMX chips to its customers including 86 out of 102
countries with ePassport projects. 
Visitors to Mobile World Congress in Barcelona (Feb 25 - 28) can
experience NXP's Trusted Mobile Smart Life Solutions at Hall 7 A111.
Together with Intrinsic-ID, NXP will demonstrate PUF technology on a
SmartMX2 test chip with Intrinsic-ID's SESAMES-award winning SATURNUS
secure cloud application.  
Links 


 
--  About SmartMX technology
--  PUF Whitepaper by NXP

  
About Intrinsic-ID 
 Intrinsic-ID is the world-wide leader in security
IP cores and applications based on patented Hardware Intrinsic
Security'(TM) technology (HIS), also referred to as 'Physical
Unclonable Function'. In HIS secret keys are extracted from the
properties of chips like an 'electronic fingerprint' and used to
offer a total protection of sensitive private and corporate data on
mobile devices, embedded systems and in the cloud. Intrinsic-ID is
headquartered in Eindhoven, The Netherlands and has sales offices in
San Jose, Tokyo and Seoul. www.intrinsic-id.com  
About NXP Semiconductors
 NXP Semiconductors N.V. (NASDAQ: NXPI)
provides High Performance Mixed Signal and Standard Product solutions
that leverage its leading RF, Analog, Power Management, Interface,
Security and Digital Processing expertise. These innovations are used
in a wide range of automotive, identification, wireless
infrastructure, lighting, industrial, mobile, consumer and computing
applications. A global semiconductor company with operations in more
than 25 countries, NXP posted unaudited revenue of $4.36 billion in
2012. Additional information can be found by visiting www.nxp.com. 
Note to Editors
 SmartMX, SmartMX2 and Integral Security are
trademarks of NXP. All other brands or product names are property of
their respective holders. 
Forward-looking Statements 
 This document includes forward-looking
statements which include statements regarding NXP's business
strategy, financial condition, results of operations and market data,
as well as other statements that are not historical facts. By their
nature, forward-looking statements are subject to numerous factors,
risks and uncertainties that could cause actual outcomes and results
to be materially different from those projected. Readers are
cautioned not to place undue reliance on these forward-looking
statements. Except for any ongoing obligation to disclose material
information as required by the United States federal securities laws,
NXP does not have any intention or obligation to publicly update or
revise any forward-looking statements after NXP distributes this
document, whether to reflect any future events or circumstances or
otherwise. For a discussion of potential risks and uncertainties,
please refer to the risk factors listed in NXP's SEC filings. Copies
of NXP's SEC filings are available from the SEC website, www.sec.gov. 
For further information, please contact: 
USA: 
Lisa Silver
Tel. +1 617 399 4913
Lisas@text100.com 
Global/Europe: 
Michael Maader
Tel. +49 (0)40 5613 3371
michael.maader@nxp.com 
GC: 
Jannet Chen
+86 21 22055883 
jannet.chen@nxp.com 
APAC: 
Lilian Li
Tel: +86 21 22052615
Lilian.li@nxp.com 
 
 
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