Mindspeed Announces Next Generation Transcede SoCs for Metro and Premium Enterprise Small Cell Applications

  Mindspeed Announces Next Generation Transcede SoCs for Metro and Premium
  Enterprise Small Cell Applications

  *High-Performance 28nm Small Cells Including LTE-A with Roadmap to LTE-B
  *Extends Field-Proven Transcede Portfolio to New Segments with Higher
    Performance

Mobile World Congress 2013

Business Wire

NEWPORT BEACH, Calif. -- February 19, 2013

Mindspeed Technologies, Inc. (NASDAQ: MSPD), the leader in system–on-chip
(SoC) solutions for small cells, today announced the third generation of its
Transcede® family of baseband processors. The first products of the new
generation are the T4400, which extends the product family to address higher
capacity metrocell class small cells, and the T3400 for premium enterprise and
lower performance metrocells. The Mindspeed® small cell SoC portfolio now
covers the complete range of small cells, from cost-effective residential
femtocells through low-cost enterprise, high performance enterprise and
picocell through to high-performance metrocells. The new products support
dual-mode capability, allowing both LTE (either LTE FDD or TD-LTE) as well as
simultaneous 3G (either HSPA or TD-SCDMA), leveraging the former Picochip
technology. Significantly, they support 3GPP Release 10 (LTE-A) and have a
roadmap to Release 12 (LTE-B).

The third generation of the Transcede family is fabricated in 28nm process and
provides four times the baseband performance of the 32nm second-generation
Transcede devices (T2200 and T3300), which are shipping today for carrier
deployment. These products are ideally suited for full featured smart
enterprise small cells and metrocells serving high-capacity usage in dense
urban areas and rural deployments. The T3400 supports 200 LTE users and 64
HSPA+ users, with 2x2MIMO with 40MHz channels. The higher performing T4400
supports up to 400 plus users in LTE mode and 128 users in HSPA+ mode, and is
capable of 4x4 MIMO with 80MHz channels. For HSPA+ the devices support
dual-carrier (DC) and Soft Handover (SHO). The new Transcede family is
architected to support not just the current LTE-A standards, including carrier
aggregation, but the upcoming standards, LTE-B / LTE-HI with even higher data
rates and more complex signal processing. LTE-Advanced (LTE-A) describes
Release 10 and 11 while the terms LTE-B and LTE-HI (LTE-Hotspot/Indoor) have
both been used about Releases 12 and 13.

All of the devices in the Transcede family are based on industry-standard
cores. They integrate CEVA® XC4000 DSP cores, multiple clusters of ARM®
Cortex™ A15 processors with symmetric multi-processing (SMP), together with
hardware accelerators and co-processors. The third generation Transcede shares
the architecture with previous generations of the Transcede and maintains
software compatibility, allowing it to leverage the field-hardened Mindspeed
internally developed PHY and partner developed stack-software. This
accelerates system manufactures development time, reduces technology risk and
enables service providers to quickly ramp new small cell deployments.
Importantly, Mindspeed's scalable, software-compatible architecture features
available headroom for developers to include unique value-added software. This
enables customers to leverage their R&D investment across multiple small cell
markets to serve demanding new applications, while delivering differentiated
products.

“Mindspeed has demonstrated its ability to move quickly, in support of a broad
variety of small cells,” commented Joe Madden, principal analyst atMobile
Experts. “Meanwhile, the market is moving ahead quickly toward strong demand
for high-capacity small cells. Trials and early deployments during 2013 will
have lasting impact on SoC market share for the next five years. Our forecast
predicts rapid adoption of dual-mode and multi-mode small cells, so the
companies with highly integrated SoCs and with experience in the field will
rise to the top.”

“The clusters of ARM Cortex- A15 processors in the Transcede platform provide
higher performance at lower power and can support both the increased
throughput and lower latency demands of next generation LTE Metro small
cells,” said Ian Ferguson, vice president, segment marketing at ARM. “By
tuning the number of ARM Cortex A-15 cores on their SOCs, Mindspeed is
providing equipment vendors with a scalable, deterministic platform to meet
the increasingly complex demands of base band processing while maintaining the
flexibility to support future requirements for content delivery at the edge of
the network.”

“Mindspeed has been at the forefront of small cell innovation with their
Transcede product line since its inception, and their latest SoC targeting
LTE-Advanced microcells and metrocells continues their strong momentum,” said
Gideon Wertheizer, CEO of CEVA. “The T3400 and T4400 leverage our CEVA-XC4000
DSP to enable a software-based architecture for small cells, offering carriers
a seamless transition to implement next generation multi-mode HSPA+/LTE/LTE-A
networks.”

"Once more, we have demonstrated Mindspeed’s small cell SoC leadership. Our
small cell product line now spans from very cost-effective residential to
high-performing public access metro-class base stations," said Dr. Naser Adas,
senior vice president and general manager of the wireless infrastructure
business unit at Mindspeed. "Today our products are shipping to carriers for
HSPA+, TD-SCDMA, LTE FDD and TD-LTE. With the new products, we will also
enable small cells with LTE-A and a roadmap to LTE-B / LTE-HI."

Mindspeed’s small cell SoC portfolio is the leader in the industry, in both
commercial and technological terms. Mindspeed is one of the first small cell
SoC companies to have LTE systems commercially deployed, and has 34 LTE small
cell design engagements. Last week Mindspeed announced that it has 63% share
of the 3GPP small cell market according to data from Infonetics Research.

The T4400 and T3400 will sample in the fourth calendar quarter of 2013.

Mindspeed will be hosting small cell technology demonstrations for service
providers, OEM customers, press and analysts during Mobile World Congress 2013
at stand 7E.104 from February 25 - 28, 2013 at the Fira Gran Via in Barcelona,
Spain.

About Mindspeed Technologies

Mindspeed Technologies (NASDAQ: MSPD) is a leading provider of network
infrastructure semiconductor solutions to the communications industry. The
company's low-power system-on-chip (SoC) products are helping to drive video,
voice and data applications in worldwide fiber-optic networks and enable
advanced processing for 3G and long-term evolution (LTE) mobile networks. The
company's high-performance analog products are used in a variety of optical,
enterprise, industrial and video transport systems. Mindspeed's products are
sold to original equipment manufacturers (OEMs) around the globe.

To learn more, please visit www.mindspeed.com. Company news and updates are
also posted at www.twitter.com/mindspeed.

Contact:

Mindspeed Technologies, Inc.
Investor Relations
Kevin Trosian
VP Business Development and Investor Relations
+1 949-579-3111
investor.relations@mindspeed.com
or
Media Contact
Rupert Baines
VP Corporate Strategy and Marketing Communication
+44 1225 469 744
rupert.baines@mindspeed.com
 
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