Semiconductor Industry Veterans From NVIDIA and Xilinx Join eBeam Initiative as Advisory Members

 Semiconductor Industry Veterans From NVIDIA and Xilinx Join eBeam Initiative
                             as Advisory Members

PR Newswire

SAN JOSE, Calif., Feb. 19, 2013

SAN JOSE, Calif., Feb. 19, 2013 /PRNewswire/ -- The eBeam Initiative, a forum
dedicated to the education and promotion of new semiconductor manufacturing
approaches based on electron beam (eBeam) technologies, today announced that
two semiconductor industry veterans—John Chen, vice president of technology
and foundry management at NVIDIA Corporation, and Hugh Durdan, vice president
of platform and solution marketing at Xilinx Inc.—have joined the organization
as advisory members. These latest additions bring the total number of eBeam
Initiative advisors and corporate members to 44. The eBeam Initiative also
announced today the launch of its video journal The Fine Line as an additional
step in fostering education in eBeam technology within the semiconductor
industry.

According to Aki Fujimura, CEO of D2S, Inc., managing company sponsor of the
eBeam Initiative, "John and Hugh bring a wealth of experience to the eBeam
Initiative. Their unique industry insight—in particular on the needs and
dynamics of the semiconductor fabless community—will prove invaluable in
supporting eBeam Initiative efforts to guide the semiconductor ecosystem in
developing and commercializing new eBeam technologies that are critical to the
future success of semiconductor manufacturing."

Added Fujimura, "We're also pleased to present our video journal The Fine
Line, which will feature perspectives from industry leaders on the latest
developments and breakthroughs associated with eBeam technology." The
inaugural issue of The Fine Line is now available on the eBeam Initiative
website at www.ebeam.org.

Chen has 36 years of experience in the semiconductor industry across
integrated device manufacturing, foundry and fabless companies. Prior to
joining NVIDIA in 2004, he held senior executive positions at FlexICs, TSMC,
WaferTech and Cypress. At TSMC, he was vice president and head of R&D, where
his responsibilities included advanced mask making among other areas. Earlier
in his career, he worked at Hughes Research Lab and Xerox Palo Alto Research
Center where he made contributions in CMOS, including e-beam direct writing,
and wrote more than 100 papers and a book titled "CMOS Devices and Technology
for VLSI."He was elected an IEEE Fellow in 1992 for leadership in and
contributions to CMOS device and process technology. Chen holds a bachelor's
degree in electrical engineering from National Taiwan University, a master's
degree in electrical engineering from the University of Maine, and a doctorate
in electrical engineering from the University of California at Los Angeles.
He also holds a master's degree from the UCLA Executive Engineering Management
Program. Previously a technical advisor for the Industrial Technology
Research Institute (ITRI) of Taiwan, Chen now serves on several academic and
industry boards.

Durdan is responsible for product definition, tools and IP marketing at
Xilinx. Prior to joining Xilinx, he spent seven years at eSilicon, where he
was most recently chief operating officer responsible for all aspects of
strategy, customer success, revenue and profitability for a $120 million
business. Earlier in his career, he was vice president and general manager of
Altera's $550 million business in the Computer, Consumer and Industrial
vertical markets. Before that, he held senior management positions at LSI
Logic, including vice president and general manager of the Computer and
Storage Division and the Consumer Division. He also led a hardware and
software development team for Intel-based server products at Digital Equipment
Corporation (DEC). Durdan received his bachelor's degree in computer and
systems engineering at Rensselaer Polytechnic Institute.

About The eBeam Initiative
The eBeam Initiative provides a forum for educational and promotional
activities regarding new semiconductor manufacturing approaches based on
electron beam (eBeam) technologies. The goals of the Initiative are to reduce
the barriers to adoption to enable more integrated circuit (IC) design starts
and faster time-to-market while increasing the investment in eBeam
technologies throughout the semiconductor ecosystem. Members and advisors,
which span the semiconductor ecosystem, include: Abeam Technologies,
Advantest, Alchip Technologies, AMTC, Applied Materials, Artwork Conversion,
Aselta Nanographics, Cadence Design Systems, CEA-Leti, D2S, Dai Nippon
Printing, EQUIcon Software GmbH Jena, e-Shuttle, eSilicon Corporation,
Fastrack Design, Fraunhofer CNT, Fujitsu Semiconductor Limited, GenISys GmbH,
GLOBALFOUNDRIES, Grenon Consulting, HOYA Corporation, IMS CHIPS, IMS
Nanofabrication AG, JEOL, KLA-Tencor, Mentor Graphics Corporation, Multibeam
Corporation, NCS, NuFlare Technology, John Chen from NVIDIA, Petersen Advanced
Lithography, Colin Harris from PMC-Sierra, Riko Radojcic from Qualcomm,
Samsung Electronics, SoftJin Technologies, STMicroelectronics, Synopsys,
tau-Metrix, Tela Innovations, TOOL Corporation, Toppan Printing, Vistec
Electron Beam Lithography Group, and Hugh Durdan from Xilinx. Membership is
open to all companies and institutions throughout the electronics industry.
To find out more, please visit www.ebeam.org.

SOURCE The eBeam Initiative

Website: http://www.ebeam.org
Contact: David Moreno, MCA, +1-650-968-8900, ext. 125, dmoreno@mcapr.com