Air Products to Highlight Advances in Electron Attachment for Soldering Applications at IPC APEX Expo

   Air Products to Highlight Advances in Electron Attachment for Soldering
                        Applications at IPC APEX Expo

EA Activated Hydrogen Technology Enables Fluxless Die Attach with Zero to
Near-Zero Voids

PR Newswire

LEHIGH VALLEY, Pa., Feb. 11, 2013

LEHIGH VALLEY, Pa., Feb. 11, 2013 /PRNewswire/ -- Air Products (NYSE: APD)
will highlight advances in its proprietary electron attachment (EA) technology
for soldering applications at the IPC APEX Expo in San Diego, Calif., from
February 19-21. IPC APEX attendees can stop by Air Products Booth #2708 to
learn about the advantages of EA activated hydrogen over plasma-based and
flux-based processes for cleaning soldering surfaces during electronics
assembly and packaging. These advantages include improved solder wetting,
lower reflow temperature, decreased overall voiding tendency, and no flux
residue-related problems.

In addition, Dr. Christine Dong, lead research scientist for merchant gases
technology at Air Products, will present the results of a study on EA
technology titled "Fluxless Die Attach by Activated Forming Gas." The study
demonstrates that it is possible to achieve a high-quality die attach with
zero or near-zero voids by using EA. Dr. Dong's presentation is part of the
Novel Attachment Technologies and Processes (S34) conference paper session to
be held on Thursday, February 21, from 10:15 AM to 12:00 PM. IPC APEX
attendees can register to learn how EA-activated forming gas can effectively
clean soldering surfaces during fluxless die attach, bringing numerous
advantages compared with conventional flux-based processes.

Air Products representatives will be available at the booth to speak with IPC
APEX attendees about the company's complete range of application technologies
and solutions that can help electronics packaging and assembly customers
improve productivity and optimize their total cost of ownership. Among these
solutions are the use of nitrogen reflow for Head-in-Pillow defect reduction
and Air Products Inert Wave Soldering technology, which has helped an
electronics contract assembly company reduce wave solder defects by 90%,
enabling them to achieve improved production efficiencies and cost savings.

Air Products is a leading supplier of specialty gases and chemicals, bulk
gases, and delivery equipment and services to the global electronics industry.
For more than 25 years, the company has been providing the electronics
packaging, assembly and test industry with technology, gases, and know-how for
wave, reflow, and selective soldering. In addition to printed circuit assembly
processes, Air Products' global technology team can support several areas of
integrated circuit packaging assembly. With a complete portfolio of reliable
gas supply options―from liquid/bulk gases to a host of on-site production
technologies―Air Products can meet the purity requirement, volume, or usage
pattern of any customer, anywhere around the world. For more information,

About Air Products

Air Products (NYSE: APD) provides atmospheric, process and specialty gases;
performance materials; equipment; and technology. For over 70 years, the
company has enabled customers to become more productive, energy efficient and
sustainable. More than 20,000 employees in over 50 countries supply innovative
solutions to the energy, environment and emerging markets. These include
semiconductor materials, refinery hydrogen, coal gasification, natural gas
liquefaction, and advanced coatings and adhesives. In fiscal 2012, Air
Products had sales approaching $10 billion. For more information, visit

NOTE: This release may contain forward-looking statements within the safe
harbor provisions of the Private Securities Litigation Reform Act of 1995.
These forward-looking statements are based on management's reasonable
expectations and assumptions as of the date of this release regarding
important risk factors. Actual performance and financial results may differ
materially from projections and estimates expressed in the forward-looking
statements because of many factors not anticipated by management, including
risk factors described in the Company's Form 10K for its fiscal year ended
September 30, 2012.

Air Products will unveil additional information about the company's electron
attachment technology at on February 19^th in
conjunction with the IPC APEX Expo.

SOURCE Air Products

Contact: Media Inquiries: Debbie Bauer, +1-610-481-8061,; Investor Inquiries: Simon Moore, +1-610-481-7461,
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