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Rudolph’s Discover Yield Management Software Gains Traction in Advanced Packaging Applications

  Rudolph’s Discover Yield Management Software Gains Traction in Advanced
  Packaging Applications

  Back-end manufacturers adopt front-end strategies to maximize yields with
                  analysis of inspection and metrology data

Business Wire

FLANDERS, N.J. -- February 11, 2013

Rudolph Technologies, Inc. (NASDAQ: RTEC), a leading provider of process
characterization equipment and software for the semiconductor, FPD, LED and
solar industries, announced today the sale of its Discover^® Yield Management
Software to a major outsourced semiconductor assembly and test (OSAT) house
for use in improving yields of its advanced packaging operations. The sale
demonstrates the growing interest among back-end manufacturers in adopting
proven yield enhancement strategies long used in front-end processes. In
response to the specific needs of advanced packaging processes, Discover
software has been enhanced to combine inspection data from inspection tools as
well as metrology data from metrology tools and metrology sensors integrated
into inspection tools.

“As advanced packaging processes in the back-end become more complex and the
structures they create become smaller, manufacturers are finding they need to
use all the data available from their processes to maximize yields,” said
Rajiv Roy, vice president of business development and director of back-end
marketing at Rudolph. “This version of Discover was specifically designed to
meet the needs of back-end processes by combining defect data from our NSX^®
Inspection Tool with bump height measurements from our Wafer Scanner™ (WS)
Inspection and Metrology System. With Discover, back-end manufacturers now
have the same solutions available to improve their process yields that have
proven to be invaluable in the front-end.”

With over twenty years of experience in yield management, Rudolph offers the
yield analysis, data management and defect classification solutions that are a
critical part of controlling yield in semiconductor and related industries.
Discover yield management software, offered in both tool-centric and fab-wide
versions, provides unique value-added capability to both the WS and NSX
systems by combining 3D and 2D data from both tools. Discover easily links to
the process equipment of choice, allows for trend analysis of both inspection
and metrology data to pin-point process issues, precisely correlates
electrical and other test results to inspection data and links into existing
databases. With production experience in memory, logic, microprocessor, ASIC,
foundry, and LED, Discover software has become a market leader in data
management by flexibly integrating into customers’ yield management strategy.

The NSX Family of inspection tools is the market leader for automated macro
defect inspection for advanced packaging. Built on that success, the NSX 320
System offers specific inspection solutions for processes using through
silicon vias (TSVs) to connect multiple die in a single package, and
continuing to serve critical inspection needs for edge trimming metrology,
wafer alignment during bonding processes and sawn wafers on film frames. With
high acceleration staging, high-speed multi-processor computing and highly
flexible software capabilities, the NSX 320 delivers industry-leading speed
and sensitivity.

Using Rudolph’s proprietary Laser Triangulation technology, the Wafer Scanner
Inspection Series provides superior 3D/2D bump and RDL metrology, and bump and
RDL defect and macro defect inspection throughout back-end processes. The
newly added optional Ultra High Resolution Sensor enables measurement of micro
bumps and RDL heights as low as 1µm. The WS system quickly and reliably
locates bump and wafer defects, reducing process costs and improving yield.

About Rudolph Technologies
Rudolph Technologies, Inc. is a worldwide leader in the design, development,
manufacture and support of defect inspection, advanced packaging lithography,
process control metrology, and data analysis systems and software used by
semiconductor device manufacturers worldwide. Rudolph provides a full-fab
solution through its families of proprietary products that provide critical
yield-enhancing information, enabling microelectronic device manufacturers to
drive down the costs and time to market of their products. The Company’s
expanding portfolio of equipment and software solutions is used in both the
wafer processing and final manufacturing of ICs, and in adjacent markets such
as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports
its customers with a worldwide sales and service organization. Additional
information can be found on the Company’s website at www.rudolphtech.com.

Safe Harbor Statement
This press release contains forward-looking statements within the meaning of
the Private Securities Litigation Reform Act of 1995 (the “Act”) which include
the benefits to customers of Rudolph’s products, Rudolph’s existing market
position and its ability to maintain and advance such position relative to its
competitors and Rudolph’s ability to meet the expectations and needs of our
customers as well as other matters that are not purely historical data.
Rudolph wishes to take advantage of the “safe harbor” provided for by the Act
and cautions that actual results may differ materially from those projected as
a result of various factors, including risks and uncertainties, many of which
are beyond Rudolph’s control. Such factors include, but are not limited to,
delays in shipping products for technical performance, component supply or
other reasons, the company’s ability to leverage its resources to improve its
positions in its core markets and fluctuations in customer capital spending.
Additional information and considerations regarding the risks faced by Rudolph
are available in Rudolph’s Form 10-K report for the year ended December 31,
2011 and other filings with the Securities and Exchange Commission. As the
forward-looking statements are based on Rudolph’s current expectations, the
company cannot guarantee any related future results, levels of activity,
performance or achievements. Rudolph does not assume any obligation to update
the forward-looking information contained in this press release.

Contact:

Rudolph Technologies, Inc.
Investors:
Steven R. Roth, 973-448-4302
steven.roth@rudolphtech.com
or
Trade Press:
Virginia Becker, 952-259-1647
virginia.becker@rudolphtech.com
 
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