Toshiba Starts Sample Shipment of Industry's First[1] Embedded NAND Flash Memory Modules

  Toshiba Starts Sample Shipment of Industry's First[1]Embedded NAND Flash
  Memory Modules

  --JEDEC UFS^[2] Ver.1.1 Standard Compliant Embedded Memories Combine up to
               64GB NAND and a Controller in a Single Package--

Business Wire

TOKYO -- February 7, 2013

Toshiba Corporation (TOKYO:6502) today announced that it has started sample
shipments of a 64-gigabyte (GB) embedded NAND flash memory module, the first
in the industry equipped with a UFS I/F. The module is fully compliant with
the JEDEC UFS Ver.1.1 standard^[3] and is designed for application in a wide
range of digital consumer products, including smartphones, tablet PCs.

Toshiba Corporation announced that it has started sample shipments of a
64-gigabyte (GB) embedded NA ...

Toshiba Corporation announced that it has started sample shipments of a
64-gigabyte (GB) embedded NAND flash memory module, the first in the industry
equipped with a UFS I/F. (Photo: Business Wire)

Samples are mainly intended for evaluation of UFS I/F and its protocol in host
chipsets and by OS vendors.

Demand continues to grow for large density, high-performance chips that
support high resolution video, driven by improved data-processing speeds in
host chipsets and wider bandwidths for wireless connectivity.

Toshiba has proved itself an innovator in this key area, and is now
reinforcing its leadership by being first in the industry to support samples
with a 64GB UFS module.

Toshiba will schedule mass-production and other densities in its line-up
according to market demand.


Product
Part Number      Density  Package                   Sample shipment
THGLF0G9B8JBAIE  64GB     169Ball 12×16×1.2mm FBGA  January 2013
                                                       

Key Features

1.The JEDEC  UFS  Ver.1.1 compliant interface handles essential functions,
    including writing block management, error correction and driver software.
    It simplifies system development, allowing manufacturers to minimize
    development costs and speed up time to market for new and upgraded
    products.
2.UFS I/F has a serial I/F. It has the scalability in number of lanes and
    speed^[4].
3.The new products are sealed in a small FBGA package, 12x16x1.2mm, and have
    a signal layout compliant with JEDEC UFS  Ver.1.1.

^[1]  For embedded NAND flash memory modules. Source: Toshiba, as of February
       2013.
^[2]   Universal Flash Storage is a product category for a class of embedded
       memory products built to the JEDEC UFS standard specification.
^[3]   JEDEC UFS Ver.1.1 standard has already been published. The Ver.2.0
       standard is now under discussion by JEDEC.
^[4]   JEDEC UFS Ver.2.0 standard will support multiple-lane and I/F speed.
       

Specifications
Interface             JEDEC ^ UFS Version 1.1 standard
                       2.7V to 3.6V (Memory core)

Power Supply Voltage   1.70V to 1.95V (Controller core)

                       1.10V to 1.30V (UFS I/F signals)
Number of lane         Downstream 1lane / Upstream 1lane
I/F Speed              2.9Gbps/lane
Temperature range      -25degrees to +85degrees Celsius
Package               169Ball 12x16x1.2mm FBGA,
                       

About Toshiba

Toshiba is a world-leading diversified manufacturer, solutions provider and
marketer of advanced electronic and electrical products and systems. Toshiba
Group brings innovation and imagination to a wide range of businesses: digital
products, including LCD TVs, notebook PCs, retail solutions and MFPs;
electronic devices, including semiconductors, storage products and materials;
industrial and social infrastructure systems, including power generation
systems, smart community solutions, medical systems and escalators &
elevators; and home appliances.

Visit Toshiba's web site atwww.toshiba.co.jp/index.htm

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Contact:

Toshiba Semiconductor & Storage Products Company
Megumi Genchi / Kunio Noguchi, +81-3-3457-3367
semicon-NR-mailbox@ml.toshiba.co.jp
 
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