Toshiba Ships Samples of Industry's First Universal Flash Storage Devices

  Toshiba Ships Samples of Industry's First Universal Flash Storage Devices

JEDEC UFS Ver.1.1 Standard Compliant Embedded Memories Combine up to 64GB NAND
and a Controller in a Single Package

PR Newswire

TOKYO and IRVINE, Calif., Feb. 7, 2013

TOKYO and IRVINE, Calif., Feb. 7, 2013 /PRNewswire/ -- Toshiba Corporation and
Toshiba America Electronic Components, Inc., (TAEC)*, a committed leader that
collaborates with technology companies to create breakthrough designs, today
announced that it began shipping samples of its 64-gigabyte (GB) embedded NAND
flash memory module equipped with a Universal Flash Storage (UFS) interface.
The first in the industry^[1], the new module is fully compliant with the
JEDEC UFS^[2] Ver.1.1 standard ^[3], and is designed for a wide range of
digital consumer products - including smartphones and tablet PCs.

With improved data processing speeds in host chipsets and wider bandwidths for
wireless connectivity, demand continues to grow for large density,
high-performance memory that supports high resolution video. A proven
innovator in this key area, Toshiba is reinforcing its leadership role by
being the first in the industry to ship samples with a 64GB UFS module.

Samples are mainly intended for evaluation of the UFS interface and its
protocol in host chipsets and by OS vendors. Toshiba will schedule mass
production of the 64GB UFS module, as well as other densities in its lineup,
according to market demand.

Product

Part Number     Density Package      Sample shipment
                        169Ball FBGA
THGLF0G9B8JBAIE 64GB                 January 2013
                        12x16x1.2mm

Key Features

  oThe JEDEC UFS Ver.1.1 compliant interface handles essential functions,
    including writing block management, error correction and driver software.
    It simplifies system development, allowing manufacturers to minimize
    development costs and speed up time to market for new and upgraded
    products.
  oUFS has a serial interface and  scalability in terms of number of lanes
    and speed^[4].
  oThe new products are sealed in a small FBGA package, 12x16x1.2mm and have
    a signal layout compliant with JEDECUFS Ver.1.1.

^[1]For embedded NAND flash memory modules. Source: Toshiba, as of February
2013.
^[2]Universal Flash Storage is a product category for a class of embedded
memory products built to the JEDEC UFS standard specification.
^[3]JEDEC UFS Ver.1.1 standard has already been published. The Ver.2.0
standard is now under discussion by JEDEC.
^[4]JEDEC UFS Ver.2.0 standard will support multiple-lane and interface speed.

Specifications

Interface            JEDEC ^ UFS Version 1.1 standard
                     2.7V to 3.6V(Memory core)

Power Supply Voltage 1.70V to 1.95V(Controller core)

                     1.10V to 1.30V (UFS I/F signals)
Number of lanes      Downstream 1 lane / Upstream 1 lane
Interface Speed      2.9Gbps/lane
Temperature range    -25degrees to +85degrees Celsius
Package              169Ball 12x16x1.2mm FBGA

*About Toshiba Corp. and TAEC

Through proven commitment, lasting relationships and advanced, reliable
electronic components, Toshiba enables its customers to create market-leading
designs. Toshiba is the heartbeat within product breakthroughs from OEMs,
ODMs, CMs, VARs, distributors and fabless chip companies worldwide. A
committed electronic components leader, Toshiba designs and manufactures
high-quality flash memory-based storage solutions, solid state drives (SSDs),
hard disk drives (HDDs), discrete devices, advanced materials, medical tubes,
custom SoCs/ASICs, imaging products, microcontrollers and wireless components
that make possible today's leading smartphones, tablets, MP3 players, cameras,
medical devices, automotive electronics, enterprise solutions and more.

Toshiba America Electronic Components, Inc. is an independent operating
company owned by Toshiba America, Inc., a subsidiary of Toshiba Corporation,
Japan's largest semiconductor manufacturer and the world's third largest
semiconductor manufacturer (Gartner, 2011 Worldwide Semiconductor Revenue,
March, 2012). Toshiba Corporation was founded in 1875 and today has over 554
subsidiaries and affiliates, with 210,000 employees worldwide. Visit Toshiba's
web site at www.toshiba.co.jp/index.htm.

For additional company and product information, please visit
http://www.toshiba.com/taec/.

Product density is identified based on the density of memory chip(s) within
the Product, not the amount of memory capacity available for data storage by
the end user. Consumer-usable capacity will be less due to overhead data
areas, formatting, bad blocks, and other constraints, and may also vary based
on the host device and application. Maximum read and write speed may vary
depending on the host device, read and write conditions, and file size. For
purposes of measuring read and write speed in this context, 1 megabyte or MB =
1,000,000 bytes.

Information in this press release, including product pricing and
specifications, content of services and contact information, is current and
believed to be accurate on the date of the announcement, but is subject to
change without prior notice. Technical and application information contained
here is subject to the most recent applicable Toshiba product specifications.
In developing designs, please ensure that Toshiba products are used within
specified operating ranges as set forth in the most recent Toshiba product
specifications and the information set forth in Toshiba's "Handling Guide for
Semiconductor Devices," or "Toshiba Semiconductor Reliability Handbook." This
information is available at www.chips.toshiba.com, or from your TAEC
representative.

All trademarks and tradenames held within are the properties of their
respective holders.

MEDIA CONTACT:
Dena Jacobson
Lages & Associates
Tel.: (949) 453-8080
dena@lages.com

SOURCE Toshiba America Electronic Components, Inc.

Website: http://www.toshiba.com/taec
Contact: Rebecca Bueno, Toshiba America Electronic Components, Inc.,
+1-949-623-3099, rebecca.bueno@taec.toshiba.com
 
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