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Micron Technology Samples New Single-Sided DDR3 Dram Module and TE Connectivity Releases Compatible, Single-Sided DDR3 Module



Micron Technology Samples New Single-Sided DDR3 Dram Module and TE
Connectivity Releases Compatible, Single-Sided DDR3 Module Connectors

Technology Leaders Target the Ultrathin Computing Market With Reduced-Height
Module and Connector Solutions

BOISE, Idaho and SHANGHAI, Feb. 7, 2013 (GLOBE NEWSWIRE) -- Micron Technology,
Inc. (Nasdaq:MU), one of the world's leading providers of advanced
semiconductor solutions, and TE Connectivity (TE) (NYSE:TEL), a world leader
in connectivity, announced today the availability of a Single-Sided SODIMM and
a low-profile single-sided, double data rate 3 (DDR3) SODIMM connector
solution to take advantage of the burgeoning market for Ultrabook™ devices,
convertibles, tablets and other thin and light devices. Aimed at providing a
reduced-height memory solution for the ultrathin computing market, the new
Single-Sided SODIMM, developed by Micron, has components on either the front
or back side of the module, but not both. When paired with the single-sided
DDR3 SODIMM connector from TE, the total z-height of the overall solution from
the motherboard is just 3mm, a 35 percent savings compared to 4.6mm for a
standard SODIMM solution.

Micron's Single-Sided SODIMM is available in a 4GB, single-rank, x8
configuration. In addition to a reduced height, this new module is built using
30nm DDR3L-RS components that consume less power in standby compared to
standard DDR3. Additionally, Single-Sided SODIMMs are pin-to-pin compatible
with current DDR3 modules, making them backward compatible with existing DDR3
SODIMM connectors.

"Given the depth and breadth of ultrathin devices currently on the market,
coupled with consumer demands for sleek, lightweight designs, Micron's
objective is to offer solutions that meet the specialized power, portability
and battery life needs," said Kris Kido, Micron's Director of Business
Development, Computing Devices. "Micron's unique Single-Sided SODIMM form
factor meets those requirements and leads the way for future developments in
this growing segment."

TE engineers designed the new single-sided DDR3 SODIMM connector to deliver
peak performance with high-speed data applications. The connector features a
35 percent reduction in height, compared with similar low-profile connectors,
which in turn, reduces the height of the end-product by 5 to 10 percent. It
also reduces motherboard shadow area by nearly 156 mm^2, or 312 mm^2 for
common dual-socket implementation. The DDR3 SODIMM connector accepts modules
that meet JEDEC MO268 industry standards and is offered in both standard and
reverse types.

"It's clear that we're seeing devices, ranging from Ultrabook™ devices to
tablets, become increasingly thinner and sleeker," said Hook Chang, product
manager, TE Consumer Devices. "In the past, the miniaturization of
circuitry-powering device memory often compromised reliability. Our DDR3
SODIMM connector solves that problem, ensuring durable connectivity to
optimize device functionality, speed and usability. Micron Technology shares
our commitment to provide consumers with high-quality, reliable cost-effective
solutions to maximize product performance."

Availability

Single-Sided SODIMM samples are available from Micron now, with mass
production scheduled for Spring, 2013.

Single-Sided SODIMM connector samples are available from TE Connectivity now,
with mass production scheduled for June, 2013.

Micron Ultrathin Memory: Embracing the Future

With a global view of the mobile computing market, Micron is well positioned
to support the growth of ultrathin applications. Our broad portfolio of
industry-leading DRAM, SSD and NOR flash make high-performance, ultrathin
computing come to life in the time it takes to snap your finger. Powerful,
highly-responsive computing, instant-on/instant-off, rapid application load
times, super slim and light designs, longer battery life and better power
savings are all possible with Micron's memory and storage solutions.

About Micron

Micron Technology, Inc., is one of the world's leading providers of advanced
semiconductor solutions. Through its worldwide operations, Micron manufactures
and markets a full range of DRAM, NAND and NOR flash memory, as well as other
innovative memory technologies, packaging solutions and semiconductor systems
for use in leading-edge computing, consumer, networking, embedded and mobile
products. Micron's common stock is traded on the NASDAQ under the MU symbol.
To learn more about Micron Technology, Inc., visit www.micron.com.

The Micron Technology, Inc. logo is available at
http://www.globenewswire.com/newsroom/prs/?pkgid=6950

About TE Connectivity

TE Connectivity (NYSE:TEL) is a $13 billion world leader in connectivity. The
company designs and manufactures products at the heart of electronic
connections for the world's leading industries including automotive, energy
and industrial, broadband communications, consumer devices, healthcare, and
aerospace and defense. TE Connectivity's long-standing commitment to
innovation and engineering excellence helps its customers solve the need for
more energy efficiency, always-on communications and ever-increasing
productivity. With nearly 90,000 employees in over 50 countries, TE
Connectivity makes connections the world relies on to work flawlessly every
day. To connect with the company, visit: www.TE.com.

©2013 Micron Technology, Inc. All rights reserved. Information is subject to
change without notice.  Micron and the Micron orbit logo are trademarks of
Micron Technology, Inc. All other trademarks are the property of their
respective owners. This news release contains forward-looking statements
regarding the production of Single-Sided SODIMMs. Actual events or results may
differ materially from those contained in the forward-looking statements.
Please refer to the documents Micron files on a consolidated basis from time
to time with the Securities and Exchange Commission, specifically Micron's
most recent Form 10-K and Form 10-Q. These documents contain and identify
important factors that could cause the actual results for Micron on a
consolidated basis to differ materially from those contained in our
forward-looking statements (see Certain Factors). Although we believe that the
expectations reflected in the forward-looking statements are reasonable, we
cannot guarantee future results, levels of activity, performance or
achievements.

CONTACT: Zeno Group for Micron  
         Mary Ellen Ynes  
         maryellen.ynes@zenogroup.com 
         650-801-7954   
        
         TE Connectivity
         Jeanne Wu
         jeanne.wu@te.com
         +86-21-33980729

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