Mitsubishi Electric Develops Multi-wire Electrical Discharge Slicing Technology for Silicon Carbide (SiC) Ingot Processing

  Mitsubishi Electric Develops Multi-wire Electrical Discharge Slicing
  Technology for Silicon Carbide (SiC) Ingot Processing

    Improves productivity of SiC slice processing for semiconductor wafers

Business Wire

TOKYO -- February 5, 2013

Mitsubishi Electric Corporation (TOKYO:6503) announced today it has developed
a prototype multi-wire electrical discharge processing technology to cut very
hard 4 inch square polycrystalline silicon carbide (SiC) ingots into 40 pieces
at once. The technology is expected to improve both the productivity of SiC
slicing and the effective use of SiC material. Mitsubishi Electric aims to
market its multi-wire electrical discharge slicer by fiscal 2015.

SiC is expected to be used increasingly in power semiconductors due to its
superior energy-saving and CO2 emissions-reduction properties compared to
silicon. Until now, sliced wafers have been produced through multi-wire saw
with diamond particles because SiC is the third hardest compound on earth, but
this method requires lengthy machining time and large kerf widths. The new
parallel multi-wire electrical discharge machining method utilizes Mitsubishi
Electric's proven electrical discharge technology for difficult-to-cut
material, and employs a dedicated power supply specially developed for SiC.

Key Technologies

Simultaneous cutting of SiC ingots into 40 pieces

  *Forty wire electrodes with a diameter of 0.1 mm aligned at 0.6mm intervals
    are rotated to cut 40 slices at once, improving productivity.
  *The non-contact, thermal process-wire electrical discharge method slices
    faster and at closer intervals compared to contact cutting (220 micro
    meters or less cut at a speed of 80 micro meters per minute)
  *More wafer slices extracted per SiC ingot for improved efficiency.

Power supply dedicated to SiC slice processing

  *Simultaneous wire cuts with even energy enabled by 40 electrically
    independent power feed contacts to wire electrodes.
  *Uninterrupted processing with even very thin (0.1mm) wire electrodes
    thanks to a newly developed high-frequency power supply tailored to the
    characteristics of SiC material.

Pending patents for the technology number 22 in Japan and 10 overseas.

About Mitsubishi Electric

With over 90 years of experience in providing reliable, high-quality products,
Mitsubishi Electric Corporation (TOKYO:6503) is a recognized world leader in
the manufacture, marketing and sales of electrical and electronic equipment
used in information processing and communications, space development and
satellite communications, consumer electronics, industrial technology, energy,
transportation and building equipment. Embracing the spirit of its corporate
statement, Changes for the Better, and its environmental statement, Eco
Changes, Mitsubishi Electric endeavors to be a global, leading green company,
enriching society with technology. The company recorded consolidated group
sales of 3,639.4 billion yen (US$ 44.4 billion*) in the fiscal year ended
March 31, 2012. For more information visit
*At an exchange rate of 82 yen to the US dollar, the rate given by the Tokyo
Foreign Exchange Market on March 31, 2012


Mitsubishi Electric Corporation
Advanced Technology R&D Center
Media Inquiries
Katsunobu Muroi, +81-3-3218-2346
Public Relations Division
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