GLOBALFOUNDRIES and Rambus Collaborate To Develop Broad IP Portfolio for 14nm-XM FinFET Process Technology

  GLOBALFOUNDRIES and Rambus Collaborate To Develop Broad IP Portfolio for
  14nm-XM FinFET Process Technology

 Companies to deliver silicon-proven complex IP blocks for advanced interface

Business Wire

SANTA CLARA, Calif. -- February 5, 2013

At today’s Common Platform Technology Forum, GLOBALFOUNDRIES, and Rambus Inc.
(NASDAQ:RMBS), the innovative technology solutions company, unveiled plans to
collaborate for the development of a broad portfolio of complex semiconductor
intellectual property (IP) optimized for GLOBALFOUNDRIES’ leading-edge process
technology. This collaboration will enable seamless integration of Rambus’
enhanced standard interface solutions into the next generation of electronics
for faster time-to-market. These silicon-proven IP blocks will address the
growing needs in applications ranging from high-performance computing to smart
mobile devices.

Rambus will develop a range of high-speed memory and chip-to-chip serial link
interfaces optimized for GLOBALFOUNDRIES processes, including the new 14nm-XM
technology, which is the industry’s first 14nm offering based on a modular
FinFET technology architecture. This new work will build on past collaboration
on several 28nm test chips that demonstrate the capabilities of Rambus’
interfaces for both mobile and server-based applications.

“Our new foundry model of Collaborative Device Manufacturing (CDM) relies on
early collaboration across the semiconductor ecosystem in order to deliver
innovative solutions at the leading edge,” said Mike Noonen, executive vice
president of marketing, sales, design and quality at GLOBALFOUNDRIES. “This
extension of our partnership with Rambus will give customers a faster path to
take advantage of Rambus’ advanced interface solutions on our new 14nm-XM
technology, opening up new avenues for chip designers to innovate on our
process technology.”

“As the industry continues its relentless drive to more advanced technologies,
deep technology engagements are required to deliver the innovative solutions
necessary to bring invention to market,” said Kevin Donnelly, senior vice
president and general manager of the Memory and Interfaces Division at Rambus.
“By engaging early with GLOBALFOUNDRIES on their advanced 14nm process, we can
combine our high speed, mixed signal design expertise with FinFET technology,
enabling a broad portfolio of silicon-proven complex IP blocks in advance of
customer needs.”

GLOBALFOUNDRIES’ 14nm-XM offering is based on a modular technology
architecture that uses a 14nm FinFET device combined with elements of
GLOBALFOUNDRIES’ 20nm-LPM process, which is well on its way to production.
Technology development is already underway, with test silicon running through
GLOBALFOUNDRIES’ Fab 8 in Saratoga County, N.Y. The XM stands for “eXtreme
Mobility,” and it is the industry’s leading non-planar architecture that is
truly optimized for mobile system-on-chip (SoC) designs, providing a whole
product solution from the transistor all the way up to the system level. The
technology is expected to deliver a 40-60% improvement in battery life when
compared to today’s two-dimensional planar transistors at the 20nm node.

Note to Editors: This news is part of a series of announcements released by
GLOBALFOUNDRIES at today’s Common Platform Technology Forum in Santa Clara,
CA. The company is featuring five partnerships designed to deliver innovative
semiconductor solutions on top of the Common Platform’s shared technology
base. The partnerships will be highlighted in a keynote entitled “Common
Technology, Uncommon Solutions,” to be delivered by Mike Noonen, executive
vice president of marketing, sales, quality and design at GLOBALFOUNDRIES. The
keynote will be streamed live beginning at approximately 10 a.m. PST and can
be accessed here:

About Rambus

Rambus is the innovative technology solutions company that brings invention to
market.Unleashing the intellectual power of our world-class engineers and
scientists in a collaborative and synergistic way, Rambus invents, licenses
and develops solutions that challenge and enable our customers to create the
future. While best known for creating unsurpassed semiconductor memory
architectures, Rambus is also developing world-changing products and services
in security, advanced LED lighting and displays, and immersive mobile media.
Additional information is available at


GLOBALFOUNDRIES is the world's first full-service semiconductor foundry with a
truly global footprint. Launched in March 2009, the company has quickly
achieved scale as the second largest foundry in the world, providing a unique
combination of advanced technology and manufacturing to more than 160
customers. With operations in Singapore, Germany and the United States,
GLOBALFOUNDRIES is the only foundry that offers the flexibility and security
of manufacturing centers spanning three continents. The company's three 300mm
fabs and five 200mm fabs provide the full range of process technologies from
mainstream to the leading edge. This global manufacturing footprint is
supported by major facilities for research, development and design enablement
located near hubs of semiconductor activity in the United States, Europe and
Asia. GLOBALFOUNDRIES is owned by the Advanced Technology Investment Company
(ATIC). For more information, visit


Jason Gorss, (518) 305-9022
Rambus Inc.
Carolyn Robinson, (408) 46208717
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