Flexible Hybrid Systems Wins FLEXI Innovation Award

  Flexible Hybrid Systems Wins FLEXI Innovation Award

 FleX Silicon-on-Polymer Combines with Printed Electronics to Enable Flexible
                                   Systems

Flexible Electronics & Displays Conference

Business Wire

BOISE, Idaho -- February 1, 2013

American Semiconductor, Inc. today announced they had received the prestigious
2013 FLEXI Award presented by the FlexTech Alliance at the 12^th Annual
Flexible Electronics and Displays conference in Phoenix, Arizona. The awards
celebrate organizations that are leading development in flexible and printed
electronics with innovative and commercially viable products and technologies.
Entries for this award were considered based on the most innovative flexible
or printed electronics product announced in the last twelve months. Judging
criteria included product design and ingenuity, potential market adoption and
revenue generation.

American Semiconductor was the recipient of the FLEXI Innovation award for its
Flexible Hybrid Systems that combine printed electronics with FleX™
Silicon-on-Polymer™. FleX is a proprietary process that converts standard
silicon wafers into flexible wafers and ICs. FleX is compatible with printed
electronics materials such that high performance ICs including memory and
logic can be integrated with printed sensors and circuitry to create Flexible
Hybrid Systems.

“Flexible Hybrid Systems create a completely new class of electronics
capability for flexible and conformally mounted systems,” said Doug Hackler,
President and CEO of American Semiconductor. “Flexible, conformal electronics
enable a wide variety of new applications in medical, aerospace, and
commercial markets. We are working to make FleX easily accessible to system
designers as demonstrated by our partnership with TowerJazz Semiconductor to
make their CS18 foundry CMOS available with a native FleX Process Design Kit.”

“FleX ICs and Flexible Hybrid Systems have demonstrated feasibility and
prototypes for many useful applications,” said Rich Chaney, General Manager of
American Semiconductor. “Flexible hybrid sensor systems can be applied to
non-flat surfaces or even embedded in structural laminates for applications
such as antennas, structural health monitoring, and even consumer devices. In
addition to making sensor systems easier to implement structurally, Flexible
Hybrid Systems improve sensor performance by moving the signal processing as
close to the sensor as possible. This also allows sensor systems to
communicate over a data bus, eliminating signal cables and saving size,
weight, and power.”

American Semiconductor offers full support for FleX IC and flexible hybrid
system development. This includes IC design support for foundry CMOS
processes, including TowerJazz CS18-FleX. Design support is available for full
custom IC design, IP development or integration, or any part of the design
flow a customer might want assistance with. Engineering support for flexible
hybrid systems includes printed electronics design, antenna design and
fabrication, FleX integration, and prototype development.

About American Semiconductor

American Semiconductor, Inc. is the industry leader in flexible integrated
circuits and flexible hybrid systems development as well as a services
provider to create flexible ICs. As an on-shore, ITAR compliant, flexible
products and services provider, American Semiconductor supports all aspects of
flexible design and processing. Services include FleX™ Silicon-on-Polymer™
technology and design engineering including design, verification, layout, and
test. Visit us at www.americansemi.com.

About FlexTech Alliance

FlexTech Alliance is devoted to fostering the growth, profitability and
success of the electronic display and the flexible, printed electronics supply
chain. FlexTech Alliance offers expanded collaboration between and among
industry, academia, government, and research organizations for advancing
displays and flexible, printed electronics from R&D to commercialization. More
information about FlexTech Alliance can be found at www.flextech.org.

American Semiconductor Inc., the American Semiconductor logo, FleX,
Silicon-on-Polymer, are trademarks of American Semiconductor, Inc.

Contact:

American Semiconductor, Inc.
Rich Chaney, 208-336-2773
richchaney@americansemi.com
www.americansemi.com
 
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