FlexTech Alliance Announces 2013 FLEXI Award Winners, Recognizing
Accomplishments in Flexible and Printed Electronics
American Semiconductor, Corning Incorporated, and Plastic Logic Honored for
Achievements in Innovation and R&D
PHOENIX and SAN JOSE, Calif., Feb. 1, 2013
PHOENIX andSAN JOSE, Calif., Feb. 1, 2013 /PRNewswire/ --FlexTech Alliance
today announced the recipients of the 2013 FLEXI Awards. American
Semiconductor, Corning Incorporated, and Plastic Logic were recognized for
significant contributions to innovation and R&D. The awards celebrate
organizations that are leading development in flexible and printed electronics
with innovative and commercially viable products and technologies. FLEXI
nominations are open to all organizations involved in these foundation
technologies. Awards were presented at the 12^th Annual Flexible Electronics
and Displays Conference held January 29 – February 1, 2013 in Phoenix,
American Semiconductor was the recipient of the FLEXI Innovation Award.
Entries for this award were considered based on the most innovative flexible
or printed electronics product announced in the last twelve months. Judging
criteria included product design & ingenuity, potential market adoption and
revenue generation. In 2012, American Semiconductor announced Flexible Hybrid
Systems with FleX™ Silicon-on-Polymer™, a proprietary process to transform
standard silicon wafers into flexible wafers. The process has been
demonstrated with functional CMOS wafers and was successfully launched into
space in June 2012 under the NASA RockSat program. A wide variety of new
applications enabled by Flexible Hybrid Systems is possible in the medical,
aerospace, and commercial markets. The award was accepted by American
Semiconductor's president and CEO, Doug Hackler.
Two companies were recognized individually for their achievements in R&D.
Entries for this award were considered based on world-class research, original
product development, and new significant commercial potential for
implementation into flexible or printed electronics. Judging was based on the
ability of entrants to identify and solve a real problem. Each of the R&D
award recipients has a unique approach for enabling the flexible products of
the future. Corning, Incorporated was recognized for its development of
Corning® Willow™ Glass, a thin and flexible display-grade glass. Plastic Logic
was honored for its color filter alignment process enabling the integration of
color displays into flexible concepts.
Corning, Incorporated received the FLEXI R&D Award for Corning Willow Glass, a
thin and flexible display-grade glass that has benefits for a variety of
electronic devices. Willow Glass can be used in producing thinner and lighter
touch panels and displays, allowing for more light weight portable devices
such as smartphones and tablets, without sacrificing device performance or
reliability. The technology also enables thin, light, and flexible solar cells
and lighting products which can be more easily integrated into both portable
devices and living spaces. Willow Glass can be used as the foundation for
electronics made by high-speed, cost effective, roll-to-roll processes,
similar to the way paper is processed for newspapers and magazines. Using a
research grant funded by the FlexTech Alliance, Corning successfully partnered
with other industry leading researchers to demonstrate the general
compatibility of a flexible glass web in a roll-to-roll processing and
printing of organic photovoltaic devices. Roll-to-roll processing, promises
larger volumes at reduced costs. Displays made on roll-to-roll platforms would
be large, thin and low-cost enough to be digital wallpaper or counter and
table tops in homes, schools and offices. The award was accepted by Dr. Sean
Garner, research associate at Corning, Incorporated.
Plastic Logic received the FLEXI R&D Award for its scalable color filter
alignment process, a transformational technology that enables the integration
of color displays into flexible concepts. The specific ability to align a
flexible color filter array to a plastic backplane could be employed by
flexible display makers, including OLED manufacturers. This transformational
technology enables innovative product manufacturers to integrate color
displays into applications such as a car dashboard or a medical bracelet. A
proper color display operation demands that the color filter structure is
perfectly aligned to the pixel array. Since a plastic film would distort
during the diverse range of fabrication techniques used to make the backplane,
Plastic Logic developed a top pixel electrode technology that would
effectively erase this distortion prior to adding the color filter. The entire
flexible electronics industry will benefit from the expertise of developing
high throughput techniques for carrying out high resolution patterning on
plastic. The award was accepted by Indro Mukerjee, CEO, Plastic Logic.
"Flexible and printed electronics form the building blocks upon which many
improvements will be made in the way we interact with electronic devices,"
said Michael Ciesinski, CEO of FlexTech Alliance. "The creative solutions in
materials, tools and processes offered by our award recipients will lead to
lower-cost, conformable electronics products."
About FlexTech Alliance
FlexTech Alliance is devoted to fostering the growth, profitability and
success of the electronic display and the flexible, printed electronics supply
chain. FlexTech Alliance offers expanded collaboration between and among
industry, academia, government, and research organizations for advancing
displays and flexible, printed electronics from R&D to commercialization.
More information about FlexTech Alliance can be found at www.flextech.org.
SOURCE FlexTech Alliance
Contact: Denise Rael, +1-408-577-1300, email@example.com
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