Molex Launches SpeedStack™ Connector System at DesignCon Delivering High-Speed Data Rates in a High-Density Connector

  Molex Launches SpeedStack™ Connector System at DesignCon Delivering
  High-Speed Data Rates in a High-Density Connector

System provides a low-profile mezzanine connector ideal for space-constrained
                                 applications

DesignCon 2013

Business Wire

LISLE, Ill. -- January 31, 2013

Molex Incorporated introduces its SpeedStack™ Mezzanine Connector System, a
high-density, low-profile solution that supports data rates of up to 40 Gbps
per differential pair. The system is ideal for OEMs that contend with limited
PCB real estate in a variety of industries including telecommunications,
networking, military, medical electronics and consumer technology. The mated
stack heights of 4.00 to 10.00mm along with a 0.80mm pitch provides design
engineers with the ultimate in flexibly to address space constraints without
sacrificing performance. The product will be on display at DesignCon 2013,
January 28 – 31, Santa Clara, CA, booth 109.

“The marketplace has a great need for a versatile, high density,
board-to-board mezzanine solution that provides space savings and high data
rates, as well as optimal airflow despite a low stack height,” said Adam
Stanczak, new product development manager, Molex. “The Molex SpeedStack
connector system not only delivers a low-profile, high-speed solution, but it
was specifically developed with a narrow housing design to allow airflow and
promote system cooling.”

The SpeedStack Connector System comes in multiple circuit sizes of 22, 44, 60,
82, 104 and 120 with a range of 6 – 32 differential pairs for even greater
flexibility. The 100 Ohm design provides superior impedance control with an 85
Ohm version to be released in June 2013 that will support PCIe* Generation
(Gen) 3.0 and Intel QuickPath Interconnect (QPI) requirements for
next-generation I/O and memory signalling. The insert-molded wafer design
includes a protective shrouded housing, providing support to the terminal
location and improved electrical balance. A common ground pin helps improve
electrical performance and minimize cross talk.

For more information about the SpeedStack Connector System, please visit
www.molex.com/link/speedstack.html. To receive information on other Molex
products and industry solutions, please sign up for our e-nouncement
newsletter at www.molex.com/link/register.

About Molex Incorporated

Providing more than connectors, Molex delivers complete interconnect solutions
for a number of markets including data communications, telecommunications,
consumer electronics, industrial, automotive, medical, military and lighting.
Established in 1938, the company operates 40 manufacturing locations in 16
countries. The Molex website is http://www.molex.com. Follow us at
http://www.twitter.com/molexconnectors watch our videos at
http://www.youtube.com/molexconnectors, connect with us at
http://www.facebook.com/molexconnectors and read our blog at
http://www.connector.com.

Molex is a registered trademark of Molex Incorporated
Speedstack is a trademark of Molex Incorporated
*PCIe is a registered trademark of PCI-SIG®.

Contact:

FOR EDITORIAL INFORMATION
Outlook Marketing Services
Christa Carroll, 630-922-6995
Christa.carroll@molex.com
or
Molex Incorporated
Larry Wegner, 630-527-2650
Larry.wegner@molex.com
 
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