STATS ChipPAC and UMC Unveil World's First 3D IC Developed under an Open Ecosystem Model

   STATS ChipPAC and UMC Unveil World's First 3D IC Developed under an Open
                               Ecosystem Model

Package-level reliability success is a significant milestone towards the
prove-out of a full-scale 3D IC solution for customers

PR Newswire

HSINCHU, Taiwan, Jan. 29, 2013

HSINCHU, Taiwan, Jan.29, 2013 /PRNewswire/ -- STATS ChipPAC Ltd.
(SGX-ST:STATSChP), a leading semiconductor advanced packaging and test
service provider, and United Microelectronics Corporation (NYSE: UMC; TWSE:
2303) ("UMC"), a leading global semiconductor foundry, today announced the
world's first demonstration of TSV-enabled 3D IC chip stacking technology
developed under an open ecosystem collaboration. The 3D chip stack, consisting
of a Wide I/O memory test chip stacked upon a TSV-embedded 28nm processor test
chip, successfully reached a major milestone on package-level reliability
assessment. This success demonstrates a total solution for reliable 3D IC
manufacturing through the combination of UMC's foundry and STATS ChipPAC's
packaging services.

"The next level of chip integration is rapidly evolving, and 3D IC technology
is poised to enable the next frontier of IC capabilities for customers under
various deployment models," said Shim Il Kwon, VP of Technology Innovation of
STATS ChipPAC. "The open ecosystem collaborative approach drives proven and
reliable 3D IC solutions for the semiconductor market by combining the foundry
partner's robust, leading-edge TSV and front-end-of-line (FEOL) process
technologies in a complementary platform with an Outsourced Semiconductor
Assembly and Test (OSAT) service provider with innovative engineering
excellence to seamlessly integrate mid-end-of-line (MEOL) and back-end-of-line
(BEOL) 3D IC processes. We are pleased with UMC's commitment to this role and
look forward to future collaborations. The results are a proven solution
platform that will enable customers to capitalize on new market

S.C. Chien, vice president of Advanced Technology Development at UMC, said,
"We see no imperative to restrict 3D IC to a captive business model, as UMC's
development work with nearly all the major OSAT partners for 3D IC has been
very productive. Our successful collaboration with a leading OSAT partner like
STATS ChipPAC has further established the viability of an open ecosystem
approach. This model should work especially well for our mutual 3D IC
customers, as foundry and OSAT can utilize their respective core strengths
during development and delivery, while customers can benefit from keeping
supply chain management flexible and realize better transparency over
technology access compared to closed, captive 3D IC business models."

UMC and STATS ChipPAC's proven open ecosystem 3D IC approach sets an important
standard for collaboration within the industry supply chain to achieve mutual
success. Under the 3D IC open development project with STATS ChipPAC, UMC
provides the FEOL wafer manufacturing, with a foundry grade fine pitch, high
density TSV process that can be seamlessly integrated with UMC's 28nm poly
SiON process flow. The know-how developed will be applied towards
implementation on the foundry's 28nm High-K/metal gate process. For MEOL and
BEOL, STATS ChipPAC performs the wafer thinning, wafer backside integration,
fine pitch copper pillar bump and precision chip-to-chip 3D stacking.

About STATS ChipPAC Ltd.

STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging
design, assembly, test and distribution solutions in diverse end market
applications including communications, digital consumer and computing. With
global headquarters in Singapore, STATS ChipPAC has design, research and
development, manufacturing or customer support offices throughout Asia, the
United States and Europe. STATS ChipPAC is listed on the SGX-ST. Further
information is available at

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that
provides advanced technology and manufacturing for applications spanning every
major sector of the IC industry. UMC's customer-driven foundry solutions allow
chip designers to leverage the company's leading-edge processes, which include
28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed
signal/RFCMOS, and a wide range of specialty technologies. Production is
supported through 10 wafer manufacturing facilities that include two advanced
300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of
Phases 1-4 which are in production for customer products down to 28nm.
Construction is underway for Phases 5&6, with future plans for Phases 7&8. The
company employs over 13,000 people worldwide and has offices in Taiwan, Japan,
Singapore, Europe, and the United States. UMC can be found on the web at

Note From UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward looking
within the meaning of the U.S. Federal Securities laws, including statements
about future outsourcing, wafer capacity, technologies, business relationships
and market conditions. Investors are cautioned that actual events and results
could differ materially from these statements as a result of a variety of
factors, including conditions in the overall semiconductor market and economy;
acceptance and demand for products from UMC; and technological and development
risks. Further information concerning these risks is included in UMC's filings
with the U.S. SEC, including on Form F-1, F-3, F-6 and 20-F, each as amended.

Editorial Contacts:

UMC                         STATS ChipPAC

Richard Yu                  Lisa Lavin

+886-2-2658-9168 ext. 16951 +1-208-867-9859

SOURCE United Microelectronics Corporation

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