Kulicke & Soffa to Present at Stifel Nicolaus and Bank of America
Stifel Nicolaus Technology Conference 2013
SINGAPORE -- January 29, 2013
Kulicke & Soffa Industries, Inc. (NASDAQ:KLIC) ("K&S") today announced that it
is scheduled to present at the Stifel Nicolaus Technology Conference and the
Bank of America Taiwan Tech and Beyond Conference, on February 5 and 6 in San
Francisco and March 13 and 14 in Taipei, respectively. Both conferences will
be webcast on the investor relations section of the Company’s website.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and
manufacture of semiconductor and LED assembly equipment. As a pioneer in this
industry, K&S has provided customers with market leading packaging solutions
for decades. In recent years, K&S has expanded its product offerings through
strategic acquisitions, adding wedge bonding and a broader range of expendable
tools to its core ball bonding products. Combined with its extensive expertise
in process technology, K&S is well positioned to help customers meet the
challenges of assembling the next-generation semiconductor and LED devices.
Kulicke & Soffa Industries, Inc.
Investor Relations & Strategic Planning
Global IR Partners
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