Rambus to Showcase Key Innovations at DesignCon 2013

  Rambus to Showcase Key Innovations at DesignCon 2013

DesignCon 2013

Business Wire

SANTA CLARA, Calif. -- January 29, 2013

Rambus Inc. (NASDAQ: RMBS)

        
Who:       Rambus Inc. (NASDAQ: RMBS)
           
Where:     DesignCon 2013
           Santa Clara Convention Center – Booth #301
           Santa Clara, CA
           
When:      January 28 – 31, 2013
           

At DesignCon 2013, Rambus will unveil the innovative R+ enhanced industry
standards platform. R+ offers the commercial benefits of industry-standard
memory and chip-to-chip interfaces while enabling customers to differentiate
products through specialized solutions. Additionally, Rambus will showcase
innovations in 3D IC interposer technology. Rambus will be at booth #301, at
the Santa Clara Convention Center in Santa Clara, CA.

Engineers from Rambus will also be presenting six technical papers on topics
including: mixed signal designs, 3D interposers, memory controllers and 3D
DRAM, high speed coded differential signaling, high-speed parallel buses and
more. (see

RAMBUS TO PRESENT SIX PAPERS AT DESIGNCON 2013).

Rambus Demonstrations:

Extending Main Memory Beyond DDR4 – An R+ Technology

The demonstration showcases technologies that can extend main memory beyond
DDR4. With data rates of up to 6.4Gbps in a multi-rank, multi-DIMM system,
this high-performance, high-capacity technology simplifies the system design
and significantly reduces the overall system power requirements.

R+ DDR3 Memory Interface Solution

This demonstration of a high-performance, low-cost DDR3 memory controller
interface solution is tailored for consumer electronics. The solution
demonstrates operation in working silicon at a data rate of 1866 megatransfers
per second (MT/s) in a low-cost wire bond package. The solution is design to
improve power efficiency and reduce risk in a cost-effective implementation.

R+ DDR3/GDDR5 Multi-Modal Interface Technology

This R+ demonstration showcases FlexMode™ technology, a low-risk, multi-modal
memory interface that can be implemented in a single SoC package design with
no additional pins. This system demonstration highlights compatibility to
single-ended memory architectures, including GDDR5 at 6 gigabits per second
(Gbps) and DDR3 at 1600MT/s.

3D IC Memory Technology

This technology is one of the latest innovations from Rambus Labs. The demo
will highlight future and potential capabilities and showcase a
high-performance, low-power 3D memory system using a double-sided IC package.

About Rambus Inc.

Rambus is the innovative technology solutions company that brings invention to
market. Unleashing the intellectual power of our world-class engineers and
scientists in a collaborative and synergistic way, Rambus invents, licenses
and develops solutions that challenge and enable our customers to create the
future. While best known for creating unsurpassed semiconductor memory
architectures, Rambus is also developing world-changing products and services
in security, advanced LED lighting and displays, and immersive mobile media.

Contact:

Rambus Inc.
Carolyn Robinson, 408-462-8717
crobinson@rambus.com
or
The Hoffman Agency for Rambus
Joseph Kilmer, 408-975-3078
jkilmer@hoffman.com
 
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