3M Launches High-Performance Embedded Capacitance Material at DesignCon 2013
-- ECM C2006 with capacitance density of 20 nF per square inch now available
for high-volume manufacturing --
SANTA CLARA, Calif. -- January 29, 2013
3M announced today at DesignCon 2013 the full launch of its Embedded
Capacitance Material (ECM) C2006. The ultra-thin laminate material is now
available for high-volume manufacturing. With a capacitance density of
approximately 20 nF per square inch, the material offers one of the highest
capacitance densities currently available on the market in a halogen-free*
ECM C2006 boosts design engineers’ ability to improve power integrity and
reduce electromagnetic interference (EMI) in small devices – such as
microphones, sensors, IC packaging and interposers – where space limitations
require the highest capacitance density feasible to achieve the desired
performance. The material’s high capacitance density helps designers achieve
hi-fidelity signals, high signal-to-noise ratio in radio frequencies and
higher speed digital signals in a variety of high-performance applications.
“The trend toward smaller devices with better performance shows no signs of
slowing,” said Abhay Joshi, global business development manager, 3M Electronic
Solutions Division, Interconnect Business. “Embedded Capacitance Material
C2006 from 3M offers one of the highest capacitance densities available today.
Now that we are ramped up to full production, design engineers can take
advantage of this tool to help them design smaller, higher-performing
3M’s line of ECM offerings can be embedded into printed circuit boards (PCBs)
and integrated circuit chip packages where the applications include decoupling
and low-pass filtering. With a high-capacitance density offering, the
functionality of the material can now be ideally leveraged for microphone
makers in the miniaturization of their products.
When used as a power-ground core in a multilayer PCB, ECM effectively becomes
a decoupling capacitor inside the board, which can allow designers to
eliminate large numbers of decoupling capacitors. The material can increase
useable board area, enable faster signaling, lower radiated emissions and save
engineering time associated with power-distribution design and board layout.
Fabricators and OEMs worldwide can use ECM from 3M without purchasing a
license from 3M. The material is halogen-free* and RoHS compliant**.
Samples of ECM C2006 are available at the 3M booth (#414) at the DesignCon
2013 Expo, which takes place Jan. 29-30 at the Santa Clara Convention Center.
To learn more about ECM solutions from 3M, visit www.3Mcapacitance.com.
About 3M Electronic Solution Division – Interconnect
3M Electronic Solutions Division’s Interconnect business offers a variety of
innovative connectors, cables and cable assemblies, embedded capacitance
materials and Textool brand test and burn-in sockets for component engineers
and designers in the electronics industry. For more information about 3M’s
Interconnect solutions, visit: http://www.3Mconnectors.com. Information about
3M Company is available online.
3M and Textool are trademarks of 3M Company.
All other trademarks listed herein are owned by their respective companies.
*Halogen-free is defined as both (1) no halogen compounds are intentionally
added to the product or used in the manufacturing process for the product, and
(2) any impurities present are less than 900 ppm bromine, less than 900 ppm
chlorine, and/or less than 1500 ppm total bromine and chlorine. The latter are
the levels set forth in certain industry standards for printed circuit boards,
such as the International Electrotechnical Commission (IEC)
**"RoHS 2011/65/EU" means that the product or part does not contain any of the
substances in excess of the maximum concentration values (“MCVs”) in EU RoHS
Directive 2011/65/EU. The MCVs are by weight in homogeneous materials. This
information represents 3M's knowledge and belief, which may be based in whole
or in part on information provided by third party suppliers to 3M.
Laurel Chesky, 512-984-7708
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