Faraday and UMC Deliver 300 Million Gate 40nm Customer SoC

          Faraday and UMC Deliver 300 Million Gate 40nm Customer SoC

ASIC + Foundry SoC partnership enables customers to realize complex SoC ICs
without expansive internal design resources

PR Newswire

HSINCHU, Taiwan, Jan. 22, 2013

HSINCHU, Taiwan, Jan. 22, 2013 /PRNewswire/ -- Faraday Technology Corporation
(TWSE: 3035), a leading ASIC and silicon IP provider, and United
Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global
semiconductor foundry, today announced that they have produced customer
system-on-chip (SoC) ICs with a density of over 300 million gates. The
successful fabrication of the communication infrastructure ICs demonstrates
the two companies' ability to deliver highly complex SoCs for third-party
customers with lower development risk, design effort, and overall

The 300 million gate-count IC was built on UMC's volume production 40nm
process. It will enable tremendous bandwidth for advanced communication
applications that require consistently high throughput capabilities. By
comparison, a standard USB 3.0 IC controller chip has 12 million gates. The
much more complex chips integrate over 100 types of IP into the design, and
feature an extra large 100MB SRAM size to power next generation communication

"Typically, this kind of complex IC requires enormous time and engineering
resources to come to fruition," said Roger Cheng, vice president of ASIC
Business at Faraday. "Working closely with UMC and our customer, we were able
to leverage Faraday's strong know-how in IP development, abundant IP pool,
efficient SoC design platform, and long-term familiarity with the foundry
process to quickly expedite the delivery of this SoC. We look forward to
bringing this product to high volume for our customer in the coming months."

S.C. Chien, vice president of Advanced Technology Development division at UMC,
said: "With a design partner with proven SoC capabilities such as Faraday,
customers can leverage the UMC-Faraday team to realize their complex SoC needs
as demonstrated by the success of this 300 million gate-count IC. These large
die-size SoCs are nearly four times the size of normal ICs, demonstrating the
high complexity involved in its design. UMC's ability to rapidly bring these
sophisticated SoCs from the design stage to manufacturing underscores our
proven advanced technology and world-class manufacturing capabilities gained
through over 30 years of semiconductor industry experience."

About Faraday

Faraday Technology Corporation is a leading fables ASIC and silicon IP
provider. The company's broad silicon IP portfolio includes I/O, Cell Library,
Memory Compiler, ARM-compliant CPUs, DDRI/II/III, MPEG4, H.264, USB 2.0/3.0,
10/100 Ethernet, Serial ATA, and PCI Express, etc. Headquartered in Taiwan,
Faraday has service and support offices around the world, including the U.S.,
Japan, Europe, and China. Faraday is listed in Taiwan Stock Exchange, ticker
3035. For more information, please visit: www.faraday-tech.com

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that
provides advanced technology and manufacturing for applications spanning every
major sector of the IC industry. UMC's customer-driven foundry solutions allow
chip designers to leverage the company's leading-edge processes, which include
28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed
signal/RFCMOS, and a wide range of specialty technologies. Production is
supported through 10 wafer manufacturing facilities that include two advanced
300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of
Phases 1-4 which are in production for customer products down to 28nm.
Construction is underway for Phases 5&6, with future plans for Phases 7&8. The
company employs over 13,000 people worldwide and has offices in Taiwan, Japan,
Singapore, Europe, and the United States. UMC can be found on the web at

Note From UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward looking
within the meaning of the U.S. Federal Securities laws, including statements
about future outsourcing, wafer capacity, technologies, business relationships
and market conditions. Investors are cautioned that actual events and results
could differ materially from these statements as a result of a variety of
factors, including conditions in the overall semiconductor market and economy;
acceptance and demand for products from UMC; and technological and development
risks. Further information concerning these risks is included in UMC's filings
with the U.S. SEC, including on Form F-1, F-3, F-6 and 20-F, each as amended.

Editorial Contacts:

UMC                          Faraday

Richard Yu                   Ronica Chen

(886) 2-2658-9168 ext. 16951 (886) 3-578-7888 ext.8350

richard_yu@umc.com           ronica_c@faraday-tech.com

SOURCE United Microelectronics Corporation

Website: http://www.umc.com
Website: http://www.faraday-tech.com
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