Molex Brings Wide-Range of Advanced Interconnect Solutions and Expertise to DesignCon

  Molex Brings Wide-Range of Advanced Interconnect Solutions and Expertise to
  DesignCon

   Company reinforces its commitment to developing high-speed, high-signal
 integrity solutions with technical presentations, demonstrations and product
                                   displays

DesignCon 2013

Business Wire

LISLE, Ill. -- January 17, 2013

Molex Incorporated continues to meet the needs of today’s design engineers by
developing products that provide not only the highest signal speeds and
integrity on the market, but also offer flexibility and scalability for
next-generation system architectures. Molex will showcase its expertise in
various forums at DesignCon 2013, January 28 – 31, 2013, Santa Clara, CA,
including several technical paper presentations and ongoing solution
demonstrations and product displays in booth 109.

Technical Paper Presentations

Each of these three 40-minute sessions highlights specific Molex technical and
application expertise:

  *Tuesday, January 29, 2013, 9:20 a.m. – 10:00 a.m. Ballroom H: Molex
    experts Gregory Fitzgerald, senior signal integrity engineer; Munawar
    Ahmad, principal engineer; Mark Bugg, project engineer and Michael Rost,
    project electrical engineer will discuss skew in twinax cables and its
    significance in next-generation differential signalling. Both insertion
    loss deviation and mode conversion will also be reviewed.
  *Wednesday, January 30, 2013, 2:00 p.m. – 2:40 p.m. Ballroom E: Rick
    Brandwein, electrical project engineer, Molex; Glenn Oliver, senior
    engineer, DuPont; Matt Doyle, signal integrity engineer, IBM; and John
    Dangler, development engineer, IBM will demonstrate how a focus on
    advanced flex circuit materials will enable flex circuits to remain valid
    interconnects. Modeled and measured data will characterize construct
    performance and “lessons learned" will be presented.
  *Thursday, January 31, 2013, 10:40 a.m. – 11:20 a.m. Ballroom G: Peerouz
    Amleshi, director; Xin Wu, senior engineer and Raghav Nallan Chakaavarthi,
    electrical engineer with Molex will join Bhavesh Patel, principal
    engineer, Dell and Casey Morrison, application engineer, Texas Instruments
    to identify the critical system signal integrity and radiated EMI impact
    factors of the conventional implementation of AC coupling capacitors in a
    25Gbps+ system through 3D modeling, channel simulation and measurement.

Product Demonstrations

The demonstrations will take place in Molex booth 109 and highlight the
company’s commitment to developing next-generation solutions for its
customers:

  *NeoScale™ 28 Gbps Speeds: Adam Stanczak, product development manager, and
    Vivek Shah, senior electrical engineer, will conduct a live demonstration
    of the latest derivatives and extensions of the NeoScale connector, a
    high-speed mezzanine solution that delivers pristine signal integrity at
    28 Gbps+ data rates. The demonstration will feature an integrated test
    board, a Molex connector, a Texas Instruments chip, LeCroy test equipment
    and cutting edge product extensions of the NeoScale design. For more
    information, please visit www.molex.com/link/neoscale.html.
  *zQSFP+: Joe Dambach, global new product development manager, will
    demonstrate zQSFP+ stacked thermal management technologies. Wind tunnel
    testing has been found to offer the most accurate, repeatable test method.
    Data is generated that will support design of NEBS rated applications with
    current and next generation pluggable I/O modules. For more information,
    please visit www.molex.com/link/zqsfp+.html.
  *Impel™ Backplane Connector System: Pete Soupir, global new product
    development manager, will be demonstrating the new Impel backplane
    technology operating at 25 Gbps over 3 different channel lengths using the
    Impel reference backplane. The output will illustrate the Impel connector
    performance in-channel using Megtron 6 and HVLP board material with
    respective transmit and receive daughtercards. For more information,
    www.molex.com/link/backplane.htm.

Products Displayed

Molex will display a range of advanced interconnect products, including:

Power:

  *EXTreme EnergetiC™ High-Current Connector System: Delivers high-end
    datacom OEMs and power supply manufacturers with an advanced solution for
    applications requiring high current up to 100.0A per bay
  *EXTreme Guardian™ System: Winner of the 2012 DesignVision Award, the
    solution features a three circuit, wire-to-board configuration that
    delivers up to 80.0A of current per circuit, a PCB header with a pitch of
    11.00 mm (0.433”) for increased PCB real estate savings and an
    EMI-shielding option to reduce cable crosstalk and improve immunity to
    external noise

I/O

  *zQSFP+™ Stacked with Thermal Management Component (TMC): Continues to
    support 100 Gbps Ethernet and 100 Gbps InfiniBand* (IB) Enhanced Data Rate
    (EDR) applications, the zQSFP+ TMC offers improved thermal performance by
    cooling both the upper and lower ports in order to conform to NEBS or
    other applications that required higher ambient temperatures of up to
    +55ºC
  *zQSFP+ iPass+™ zHD Vertical Connector System: Provides a 0.75mm pitch
    vertical connector that meets requirements of SAS-3 and projected SAS-4
    bandwidth

Mezzanine

  *NeoScale™ High-Speed Mezzanine System: Offers 2, 4, 6 and 8 row versions
    with a column range of 4 to 30 columns and stack heights of 12.00 to
    42.00mm to support a wide range of mezzanine applications
  *SpeedStack™ Connector System: Provides PCB real-estate space savings while
    optimizing airflow with a low-profile stack height of 4.00mm, achieving up
    to 40 Gbps per differential pair

Backplane

  *Impel™ Backplane Connector System: This scalable backplane product
    provides OEMs with an upgrade model, so that they can purchase a reduced
    cost daughtercard that is a viable solution for 16 Gbps, and can upgrade
    to a plug-compatible daughtercard solution for 25 Gbps or beyond.
  *Impact™ XTR Daughter Cards: A daughtercard enhancement of the Impact
    product family, XTR provides an upgrade path for increased signal
    integrity margin necessary for evolving high-speed development, supporting
    25 Gbps+.

To receive information on other Molex products and industry solutions, please
sign up for our e-nouncement newsletter at www.molex.com/link/register/.

About Molex Incorporated

Providing more than connectors, Molex delivers complete interconnect solutions
for a number of markets including data communications, telecommunications,
consumer electronics, industrial, automotive, medical, military and lighting.
Established in 1938, the company operates 40 manufacturing locations in 16
countries. The Molex website is http://www.molex.com. Follow us at
http://www.twitter.com/molexconnectors watch our videos at
http://www.youtube.com/molexconnectors, connect with us at
http://www.facebook.com/molexconnectors and read our blog at
http://www.connector.com.

Molex is a registered trademark of Molex Incorporated

Contact:

Outlook Marketing Services
Christa Carroll, 630-922-6995
Christa.carroll@molex.com
or
Molex Incorporated
Larry Wegner, 630-527-2650
Larry.wegner@molex.com
 
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