Telit Introduces Two Qualcomm Technologies, Inc. Based Modules Expanding 3G HSPA and HSPA+ Offerings for Global M2M Markets

  Telit Introduces Two Qualcomm Technologies, Inc. Based Modules Expanding 3G
  HSPA and HSPA+ Offerings for Global M2M Markets

 Cost-effective UE910 V2 and mid-range HE910 V2 modules to supplement breadth
         of Telit's pin-compatible xE910 solutions for HSPA and HSPA+

Business Wire

RALEIGH, N.C. -- January 8, 2013

Telit Wireless Solutions, a leading global vendor of high-quality
machine-to-machine (M2M) modules and value-added services, today announced the
introduction of the UE910 V2 HSDPA and HE910 V2 HSPA+ modules based on
Qualcomm Technologies, Inc. chipsets, each to be banded for European and North
American markets. Both products feature dual-band 3G and GSM/GPRS/EDGE
support. The entry-level 3G UE910 V2 is based on Qualcomm Technologies'
QSC6270 chipset and delivers a top 3.6Mbps downlink data rate. The HE910 V2 is
based on Qualcomm Technologies' MDM6200 chipset and delivers up to 14.4Mbps
downlink and 5.76Mbps uplink data rates.

The new products are fully compatible with Telit's xE910 family and can be
easily dropped into existing or planned designs for xE910 modules requiring no
additional rework. Positioned at entry-level and mid-range respectively, the
new Qualcomm Technologies-based UE910 V2 and HE910 V2 modules enable the Telit
xE910 family to enhance cross-technology compatibility with its other popular
global air-interface technologies. The application of the Qualcomm
Technologies chipsets improves interchangeability between CDMA (1xRTT, EV-DO)
and UMTS (HSDPA, HSPA+) variants making the adaptation of customer
applications to regional technical requirements quick and easy, minimizing
time to market and total cost of ownership.

The QSC6270-based UE910 V2 is to be positioned as a 2G to 3G migration path
product, and includes high-value features such as analog audio, making it
ideal for applications from home and commercial security and surveillance
systems, to asset monitoring, logistics, and mass-transit monitors. Telit is
planning a UE910 V2 variant based on QSC6270-Turbo with additional support for
Java J2ME 3.2 and eCall.

The MDM6200-based HE910 V2 is fully digital audio capable, supports both GPS
and GLONASS location technologies, and provides full-duplex PCM input and
output. These features combined with the up to 14.4Mpbs downlink and 5.76Mbps
uplink data rates make the product ideal for applications such as a video
surveillance and security, and other emerging applications areas such as
healthcare, Smart Home, and Smart Grid.

Both the UE910 V2 and HE910 V2 will be available in local band-group variants
as required for all major carriers and partner networks in North America and
Europe. The Qualcomm Technologies-based products will be available in North
America with 850/1900MHz and in Europe with 900/2100MHz dual-band
combinations. Both regional variants will be available in data-only as well as
data & voice variants.

"The Qualcomm Technologies-based entry-level 3G UE910 V2 and mid-range HE910
V2 are Telit's new 3G products launched in response to increasing demand for
dual-band HSDPA, and HSPA+ modules," said Dominikus Hierl, chief marketing
officer at Telit Wireless Solutions. "They come to address the need from
application areas and regions requiring easy interchangeability between CDMA
or UMTS lines of air interface technology, particularly in United States,
Europe and key opportunities."

"Qualcomm Technologies' fully-integrated QSC6270, QSC6270-Turbo and MDM6200
chipsets support the bandwidth and feature requirements of a broad range of
M2M applications, and we are pleased to enableHSDPA, and HSPA+ products in
the xE910 family," said Nakul Duggal, vice president of product management for
IOE, Qualcomm Technologies. "By using Qualcomm Technologies' Gobi 3G solutions
in its xE910 product family, Telit will be able to offer its customers the
technology flexibility to address M2M products and drive 2G to 3G migration in
Europe and North America."

About Telit

Telit Wireless Solutions is a brand of Telit Communications PLC (AIM: TCM), an
enabler of machine-to-machine (M2M) communications worldwide providing
wireless module technology, M2M managed services and value added services,
including connectivity. Exclusively dedicated to M2M with more than 12 years
of experience in the market, the company constantly enhances its technology
leadership with six R&D centers around the globe. Telit offers an extensive
portfolio of the highest quality cellular, short-range RF, and GNSS modules,
available in over 80 countries. By supplying scalable products that are
interchangeable across families, technologies, and generations, Telit is able
to keep development costs low and protect customers' design investments. In
addition, Telit is the only module provider in the market today to offer a
value added services bundle including connectivity dedicated to simplifying
the deployment of M2M applications.

Contact:

Telit Wireless Solutions
Leslie Hart, 919-415-1510
Director of Marketing
leslie.hart@telit.com
 
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