STMicroelectronics Leverages Cable Know-How to Support

STMicroelectronics Leverages Cable Know-How to Support
Next-Generation Multimedia and Internet Services 
First 16x4 Capable Cable Modem DOCSIS(R) 3.0 Chips Reach Market
Quickly After Successful September Technology Demonstration 
GENEVA -- (Marketwire) -- 01/04/13 --   STMicroelectronics (NYSE:
STM), a global semiconductor leader serving customers across the
spectrum of electronics applications and a leading producer of ICs
for cable set-top boxes and home gateways, has revealed the first
three chips in its new family supporting the DOCSIS 3.0 cable-modem
specification. 
Since first demonstrating its DOCSIS 3.0 technology in September
2012, ST has moved quickly to introduce the 12-channel STiD125 and
16-channel STiD127 for set-top box or headed gateway front-end, and
the 16-channel STiD128 for cable modems and data gateways including
headed gateway front-end. These are believed to be the world's first
DOCSIS 3.0 devices providing up to 16 downlink channels, with four
uplink channels, enabling data speeds of up to 800Mbps downstream and
108Mbps upstream. 
DOCSIS 3.0 provides the framework for home and mobile entertainment
to evolve from legacy MPEG to IP video distribution. The extremely
high data rates enable set-top boxes and home gateways to deliver
video and internet data converged services over a single network and
support simultaneous use of multiple connected devices, such as smart
televisions, digital video recorders (DVRs), tablets, smartphones and
game consoles in the home. With the availability of DOCSIS 3.0,
industry research firm IMS has predicted the market for DOCSIS home
devices will grow from 32 million units per year in 2012 to more than
49 million by 2015. 
ST's DOCSIS 3.0 technology is associated with a dual-core ARM(R)
Cortex(TM)-A9 processor to control routing, switching and telephony
functions. ST's DOCSIS 3.0 devices are taking advantage of their
association with ST's advanced set top box devices such as the Orly
STiH416 to provide security and media server functions, for services
such as pay TV and internet-based services used in next-generation
connected-home products. 
"The rapid introduction of these devices leverages ST's proven
expertise in this arena, as ST has already shipped tens of millions
of first- and second-generation DOCSIS chi
ps," said Laurent Remont,
ST's Digital Convergence Group Vice President and Unified Platform
Division General Manager. "As the first company to demonstrate
16x4-channel DOCSIS 3.0 technology, the speed with which we're
launching our latest family allows operators to deliver more advanced
services to multiple connected users throughout the home." 
ST will release Product Development Kits (PDK) for the STiD125,
STiD127 and STiD128, targeting the 23x23 BGA package, in Q1 2013. 
Major features of STiD125/127/128: 


 
--  Multiple high-speed DOCSIS 3.0 channels: up to 16x4 data, up to 8
    video
--  Rich connectivity: Full Spectrum Tuner interface, up to 3 Ethernet
    ports, up to 2 PCI-e (Wi-Fi DBC) ports, 200Mb/s Digital Video
    Transport Stream output bus
--  Enhanced Internet telephony with PacketCable(TM) 1.5 and 2.0 support
--  Low-power, high-performance multi-core ARM processor delivering
    industry- best power and performance

  
About DOCSIS 3.0: 
DOCSIS (Data Over Cable Service Interface Specifications) are the
dominant cable modem specifications adopted by cable service
providers and equipment suppliers in North America. The equivalent
EuroDOCSIS specification is widely used throughout Europe. By
supporting leading-edge data rates, successive DOCSIS specifications
have enabled cable TV operators to become full-service video, voice
and data telecommunications providers. 
The latest version, DOCSIS 3.0, supports Internet Protocol TV (IPTV)
allowing services such as on-demand content and streaming video, with
static or dynamic multicasting for enhanced quality of service. It
also supports the next-generation Internet Protocol (IPv6), which
significantly extends the IP address range to permit more devices to
connect to the Internet.
 Other advances include support for channel
bonding, which is a flexible technique for increasing the maximum
data bandwidth of cable modems. ST's DOCSIS 2.0 compliant STi7141
supports downlink data speeds of 40Mbps, while DOCSIS 3.0 technology
with channel bonding has potential for up to 800Mbps. This is a
significant advantage enabling cable operators to deliver rich
multimedia services and fast Internet access to multiple home users,
simultaneously.  
About STMicroelectronics
 ST is a global leader in the semiconductor
market serving customers across the spectrum of sense and power and
automotive products and embedded processing solutions. From energy
management and savings to trust and data security, from healthcare
and wellness to smart consumer devices, in the home, car and office,
at work and at play, ST is found everywhere microelectronics make a
positive and innovative contribution to people's life. By getting
more from technology to get more from life, ST stands for
life.augmented.
 In 2011, the Company's net revenues were $9.73
billion. Further information on ST can be found at www.st.com. 
ST DOCSIS 3.0 Modem SoCs:
http://hugin.info/152740/R/1668317/541683.pdf 
 ST DOCSIS 3.0 Modem
SoCs_IMAGE: http://hugin.info/152740/R/1668317/541684.jpg  
For Press Information Contact:
STMicroelectronics
Michael Markowitz
Director Technical Media Relations
+1 781 591 0354
michael.markowitz@st.com