SMIC Achieves Breakthrough in Backside-Illuminated Image Sensors

       SMIC Achieves Breakthrough in Backside-Illuminated Image Sensors

PR Newswire

SHANGHAI, Dec. 20, 2012

SHANGHAI, Dec. 20, 2012 /PRNewswire/ -- Semiconductor Manufacturing
International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), China's largest and
most advanced semiconductor foundry, today announced a breakthrough in its
development of backside-illuminated (BSI) CMOS image sensor (CIS) technology,
with the first test chip demonstrating good image quality even in low-light
conditions. The complete BSI process technology, which has been independently
developed by SMIC, will serve the market for high-end mobile phone cameras,
and is targeted to enter risk production with partnering customers in 2013.

SMIC's success in BSI process development will broaden its CIS foundry service
offerings to customers with five-megapixel and higher resolution phone cameras
and high-performance video camera products. BSI sensors are more
light-sensitive than frontside-illuminated CMOS sensors, allowing today's top
smartphones to take brighter, clearer pictures at night or indoors. While
driving its BSI technology toward commercial production, the company is soon
to begin early development of next-generation CIS technology based on 3D
integrated circuits.

"We are proud to be the first Chinese foundry to successfully develop BSI CMOS
image sensors," said SMIC CEO Dr. TY Chiu. "CMOS image sensors are among the
key value-added technologies that SMIC offers for customers in the mobile
device and imaging markets."

"With this achievement as a stepping stone, our development team will drive
the BSI sensor technology to timely commercialization," added Dr. Shiuh-Wuu
Lee, SMIC's Senior Vice President of Technology Development. "This
breakthrough further solidifies SMIC's position as the advanced technology
leader in China."

Since the introduction of its frontside-illuminated CIS process in 2005, SMIC
has become a major foundry for CIS wafers, primarily for mobile phone and
consumer electronics applications. In order to provide turnkey CIS fabrication
service, SMIC and Toppan Printing of Japan operate a joint venture, Toppan
SMIC Electronics (Shanghai) Co., Ltd., (TSES), which fabricates on-chip color
filters and micro lenses at SMIC's Shanghai site.

About SMIC

Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI;
SEHK: 981) is one of the leading semiconductor foundries in the world and the
largest and most advanced foundry in Mainland China, providing integrated
circuit (IC) foundry and technology services at 0.35-micron to 40-nanometer.
Headquartered in Shanghai, China, SMIC has a 300mm wafer fabrication facility
(fab) and three 200mm wafer fabs in its Shanghai mega-fab, two 300mm wafer
fabs in its Beijing mega-fab, a 200mm wafer fab in Tianjin, and a 200mm fab
under construction in Shenzhen. SMIC also has customer service and marketing
offices in the U.S., Europe, Japan, and Taiwan, and a representative office in
Hong Kong. In addition, SMIC manages and operates a 300mm wafer fab in Wuhan
owned by Wuhan Xinxin Semiconductor Manufacturing Corporation.

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Safe Harbor Statements
(Under the Private Securities Litigation Reform Act of 1995)

This press release contains, in addition to historical information,
"forward-looking statements" within the meaning of the "safe harbor"
provisions of the U.S. Private Securities Litigation Reform Act of 1995.
These forward-looking statements are based on SMIC's current assumptions,
expectations and projections about future events. SMIC uses words like
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statements involve significant risks, both known and unknown, uncertainties
and other factors that may cause SMIC's actual performance, financial
condition or results of operations to be materially different from those
suggested by the forward-looking statements, including among others risks
associated with the current global economic slowdown, orders or judgments from
pending litigation and financial stability in end markets.

Investors should consider the information contained in SMIC's filings with the
U.S. Securities and Exchange Commission (SEC), including its Annual Report on
Form 20-F filed with the SEC on April 27, 2012, especially in the "Risk
Factors Related to Our Financial Condition and Business" and "Operating and
Financial Review and Prospects" sections, and such other documents that SMIC
may file with the SEC or the Hong Kong Stock Exchange from time to time,
including current reports on Form 6-K. Other unknown or unpredictable factors
also could have material adverse effects on SMIC's future results, performance
or achievements. In light of these risks, uncertainties, assumptions and
factors, the forward-looking events discussed in this press release may not
occur. You are cautioned not to place undue reliance on these forward-looking
statements, which speak only as of the date stated, or if no date is stated,
as of the date of this press release. Except as may be required by law, SMIC
undertakes no obligation and does not intend to update any forward-looking
statement, whether as a result of new information, future events or otherwise.

SMIC Contact Information:

English Media

William Barratt

Tel: +86-21-3861-0000 x16812


Chinese Media

Angela Miao

Tel: +86-21-3861-0000 x10088


SOURCE Semiconductor Manufacturing International Corporation

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