UMC Achieves Foundry's First 55nm SDDI Customer Product Tape-out

       UMC Achieves Foundry's First 55nm SDDI Customer Product Tape-out

World's first 55nm display driver IC process enables Full-HD smartphone

PR Newswire

HSINCHU, Taiwan, Dec. 18, 2012

HSINCHU, Taiwan, Dec.18, 2012 /PRNewswire/ --United Microelectronics
Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor
foundry, today announced that it has taped out the foundry industry's first
customer product utilizing 55nm small display driver IC (SDDI) process
technology. UMC, the world's leading SDDI foundry in both process technology
and shipping volume, is now the first foundry to offer a 55nm version of the
process to enable Full-HD resolutions for today's smartphones. 

Yau Kae Sheu, senior director of UMC's 12-inch Specialty Technology
Development division, said,"This world-leading 55nm SDDI process nicely
complements our comprehensive display driver technology portfolio. With our
volume production 0.13um and our recently introduced new generation 80nm SDDI
technologies, customers now have the flexibility to design into a full range
of smartphone resolutions depending on their application, including WVGA, qHD,
HD720/WXGA, and now Full-HD, fully covering smartphone display requirements
from 3.5-inch to larger than 5-inch."

The 55nm SDDI process features an ultra small SRAM size (0.4um2) and provides
an ideal balance of power consumption, performance, and chip size for
integration into high-end Full-HD smartphones that demand low power and a slim
profile. 55nm SDDI customer products will be manufactured using advanced 300mm
wafer technology, with fast manufacturing cycle to fit customer time-to-market
needs. The 55nm process leverages UMC's world-leading position in SDDI, with
over 300 million SDDI chips shipped for today's mainstream smartphones.

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that
provides advanced technology and manufacturing for applications spanning every
major sector of the IC industry. UMC's customer-driven foundry solutions allow
chip designers to leverage the company's leading-edge processes, which include
28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed
signal/RFCMOS, and a wide range of specialty technologies. Production is
supported through 10 wafer manufacturing facilities that include two advanced
300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of
Phases 1-4 which are in production for customer products down to 28nm.
Construction is underway for Phases 5&6, with future plans for Phases 7&8. The
company employs over 13,000 people worldwide and has offices in Taiwan, Japan,
Singapore, Europe, and the United States. UMC can be found on the web at

Note From UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward looking
within the meaning of the U.S. Federal Securities laws, including statements
about future outsourcing, wafer capacity, technologies, business relationships
and market conditions. Investors are cautioned that actual events and results
could differ materially from these statements as a result of a variety of
factors, including conditions in the overall semiconductor market and economy;
acceptance and demand for products from UMC; and technological and development
risks. Further information concerning these risks is included in UMC's filings
with the U.S. SEC, including on Form F-1, F-3, F-6 and 20-F, each as amended.

Editorial Contacts:

Richard Yu
+886-2-2658-9168 ext. 16951

SOURCE United Microelectronics Corporation

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