InvenSense 3rd NF-Shuttle Ready for January 7 Launch Demand for recently opened MEMS fabrication platform increasing; company now taking orders for May 2013 NF-Shuttle Business Wire SUNNYVALE, Calif. -- December 12, 2012 InvenSense, Inc. (NYSE: INVN), the leading provider of MotionTracking^™ devices for consumer electronics, today announced that its 3^rd NF-Shuttle that allows 3^rd-party developers to build MEMS prototypes on the company’s proprietary MEMS fabrication process is scheduled to launch on January 7. The company also announced it is now taking orders for its 4^th NF-Shuttle, which is slated to launch in May 2013. NF-Shuttle designs are fabricated on the same NF Platform that produced several hundred million inertial MEMS units for InvenSense. Fari Assaderaghi, Vice President of Advanced Technology at InvenSense, noted, “Opening our NF Platform, this past May, to outside developers was a precedent-setting event for the MEMS industry. We are finding the decision to be rewarding to InvenSense, universities, research institutions and other MEMS developers that are seeking to accelerate their development timeframes. We are excited about the demand we have experienced to date and are looking forward to increasing our subscriber base over the coming year.” Professor Bernhard Boser, Professor of Electrical Engineering at U.C. Berkeley, said, “For a DARPA-funded project on next-generation gyroscopes, we were in need of a fabrication process that allows for tight integration of a mechanical transducer and ultra-low noise electronics, and one that would provide silicon in a quick turnaroundtime. We found the InvenSense NF-Shuttle to be particularly well suited for our needs. Due to our success with the program, we are looking forward to fabricating additional designs on the NF Platform.” About the NF-Shuttle The InvenSense NF-Shuttle is a silicon CMOS-MEMS platform where mask costs are split amongst multiple users as they can purchase "seats" on the same mask. This approach reduces production costs for participants to a fraction of the total and thus provides a greater opportunity to verify their advanced designs and prototypes in silicon. To learn more about participating in InvenSense’s NF-Shuttle Program, please contact InvenSense at email@example.com About InvenSense’s Proprietary Fabrication Platform The InvenSense NF Platform is able to combine MEMS on CMOS (also known as CMOS-MEMS) in a small, cost effective standard package resulting in significant performance, reliability, integration and cost benefits. The combining of a MEMS wafer with an industry standard CMOS wafer allows InvenSense to reduce the number of MEMS manufacturing steps, perform wafer-level testing, and use chip-scale packaging, thereby reducing back-end costs of packaging and testing and improving overall yield. The InvenSense approach is proven to address MEMS electrical interconnect issues, hermetically seals MEMS structures at the wafer level and enables standard low-cost semiconductor packaging and testing. The NF Platform has enabled the development of world class inertial sensors with the industry’s lowest noise performance, lowest power consumption, and smallest package size. Two leading semiconductor foundries, Global Foundries and TSMC, installed the InvenSense patented and proprietary fabrication platform on their 8” CMOS production lines. About InvenSense InvenSense Inc. (NYSE: INVN) is the world’s leading provider ofMotionTracking^™solutions for consumer electronic devices. The company’s patentedNF Platform and patent-pending MotionFusion^™ technology address the emerging needs of many mass-market consumer applications via improved performance, accuracy, and intuitive motion- and gesture-based interfaces. InvenSense technology can be found in consumer electronic products including smartphones, tablets, gaming devices, optical image stabilization, and remote controls for Smart TVs. The company’s MotionTracking products are also being integrated into a number of industrial applications. InvenSense is headquartered in Sunnyvale, California and has offices in China, Taiwan, Korea, Japan, and Dubai. More information can be found atwww.invensense.com. ©2012 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps, DMP, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated. © 2012 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, Nasiri-Fabrication, MotionFusion, MotionApps, DMP, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the respective companies with which they are associated. Contact: InvenSense, Inc. Eileen Elam, 408-988-7339 firstname.lastname@example.org
InvenSense 3rd NF-Shuttle Ready for January 7 Launch
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