Molex Introduces LGA 2011-0 CPU Socket Supporting Top-of-the-Line Intel Core* i7 Series Processors

  Molex Introduces LGA 2011-0 CPU Socket Supporting Top-of-the-Line Intel
  Core* i7 Series Processors

Intel-approved LGA 2011-0 CPU socket meets reliability requirements for target
    processor performance levels of servers, workstations and high-end PCs

Business Wire

LISLE, Ill. -- December 11, 2012

Molex Incorporated has augmented its CPU solutions with the launch of an
Intel-approved LGA 2011-0 CPU socket for the Intel Core* i7 series of
32nm-Sandy Bridge-E microprocessors. Designed to handle 130W Thermal Design
Power (TDP), the LGA 2011-0 socket replaces the LGA 1366 CPU socket, which was
used with the Intel Core i7-930, i7-950, i7-960, i7-980 and i7-990X
processors.

“The new LGA 2011-0 socket delivers the improved electrical, mechanical and
thermal reliability needed to achieve target performance levels of Intel Core
i7-3930K, i7-3820 and i7-3960K Extreme Edition processors used in enterprise
servers, workstations and high-end PCs,” states Carol Liang, global product
manager, Molex. “A higher pin-count and the greater contact density of the
compact LGA 2011 socket make it ideal to support the condensed package—and
powerful features of Intel 2^nd generation, top-of-the-line Core i7 series
processors in breakthrough performance applications.”

An innovative fully-loaded interstitial seating plane (ISP) design improves
contact reliability of the Molex LGA 2011-0 socket by preventing circuit opens
and shorts caused by contact deformation during a package overload. The LGA
2011-0 socket is compatible with a Standard (Square) and a Narrow ILM design
assembly. The Standard ILM has a larger (80x80mm) keep-out zone than the
Narrow ILM (56x94mm). The LGA 2011-0 socket is not backward compatible for use
with any other processors and their ILM assemblies.

“The unique ISP design of the LGA 2011-0 socket minimizes risk of electrical
shorting during processor overloads—protecting the investment of users who
depend on higher system and operation reliability,” adds Liang.

The LGA 2011-0 CPU socket uses high strength, copper alloy contacts for robust
performance. Socket terminals are oriented at angles that reduce the risk of
cross-contact during processor overloads. Molex also offers 15 or 30 micron
gold-plated contact sockets with pick-and-place covers for easy placement in
automated board assembly. All sockets are shipped in JEDEC-type hard trays.

For additional information visit: www.molex.com/link/lga2011.html. To receive
information on other Molex products and industry solutions, please sign up for
our e-nouncement newsletter at http://www.molex.com/link/register/.

About Molex Incorporated

Providing more than connectors, Molex delivers complete interconnect solutions
for a number of markets including data communications, telecommunications,
consumer electronics, industrial, automotive, medical, military and lighting.
Established in 1938, the company operates 40 manufacturing locations in 16
countries. The Molex website is http://www.molex.com. Follow us at
http://www.twitter.com/molexconnectors watch our videos at
http://www.youtube.com/molexconnectors, connect with us at
http://www.facebook.com/molexconnectors and read our blog at
http://www.connector.com.

* Intel Core is a trademark of Intel Coporation.

Molex is a registered trademark of Molex Incorporated

Contact:

FOR EDITORIAL INFORMATION
Christa Carroll
Outlook Marketing Services
630-922-6995
Christa.Carroll@molex.com
or
Larry Wegner
Molex Incorporated
630-527-2650
Larry.Wegner@molex.com