SUSS MicroTec Japan Seminar in Tokyo addressed critical challenges for 3D Integration and Next Generation Lithography

  SUSS MicroTec Japan Seminar in Tokyo addressed critical challenges for 3D
  Integration and Next Generation Lithography

Business Wire

GARCHING, Germany -- December 05, 2012

SUSS MicroTec, a global supplier of equipment and process solutions for the
semiconductor industry and related markets, hosted the SUSS MicroTec Japan
Seminar 2012 on December 4, at the Hyatt Regency Tokyo. In two parallel tracks
the latest developments in 3D Integration and Next Generation Lithography as
193i, EUVL and NIL were presented and discussed. Both seminars attracted
approximately 200 attendees.

The very well attended seminar on 3D Integration addressed the latest
developments in 2.5D/3D Packaging. Industry leading companies and market
research institutes like Yole Développement shared their views on the
technology road map and on the 3DIC market for high performance computer &
server networks, smartphones and tablets. These applications have been
identified as today's major market drivers.

The Next Generation Lithography (NGL) seminar focused on advances in mask
manufacturing technologies. The industry still faces significant challenges
for EUVL pilot lines and their future introduction to high volume
manufacturing. This Session spot-lighted on EUVL challenges including critical
processes from the mask prospective. In addition, the session touched on other
lithography solutions such as 193i extension, Nano Imprint Lithography and
Direct Self Assembly (DSA).

'On one hand Moore's Law is demanding further shrinking and drives EUVL as
well as alternative lithography technologies, but on the other hand 2.5D/3D
Integration gains importance and is in the strategic focus of many global
players. We hosted this Seminar to present our solutions on both sides and to
discuss remaining technological challenges with customers and cooperation
partners', says Frank P. Averdung, President and CEO of SUSS MicroTec. 'We
presented our solutions for thin wafer handling, wafer bonding and our leading
mask processing technology. We also introduced new technological capabilities,
such as Tamarack's UV-Projection Lithography and Laser Processing Technology.'

The Forum on 3D Integration featured representatives from the Industrial
Technology Research Institute (ITRI), Yole Développement, Interconnection
Technologies, Fujitsu, Tokyo University, Thin Materials AG, Brewer Science,
D-Process, Toray Engineering, Cookson Electronics and Electroplating Engineers
of Japan (EEJA). The Next Generation Lithography Session featured
representatives from Toshiba, Dai Nippon Printing, Toppan Printing,
Gigaphoton, FUJIFILM, Asahi Glass, Nuflare Technology and Molecular Imprint.

About SUSS MicroTec

SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, is a leading supplier
of equipment and process solutions for microstructuring in the semiconductor
industry and related markets. In close cooperation with research institutes
and industry partners SUSS MicroTec contributes to the advancement of
next-generation technologies such as 3D Integration and nanoimprint
lithography as well as key processes for MEMS and LED manufacturing. With a
global infrastructure for applications and service SUSS MicroTec supports more
than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in
Garching near Munich, Germany. For more information, please visit

End of Media Release


Language:   English
Company:      SÜSS MicroTec AG
              Schleissheimer Strasse 90
              85748 Garching
Phone:        +49 (0)89 32007-161
Fax:          +49 (0)89 32007-451
ISIN:         DE000A1K0235
WKN:          A1K023
Indices:      TecDAX
Listed:       Regulierter Markt in Frankfurt (Prime Standard); Freiverkehr in
              Düsseldorf, Hamburg, München, Stuttgart



SUSS MicroTec AG
Franka Schielke
Tel.: +49 (0)89 32007-161
Fax: +49 (0)89 32007-451
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