UMC Unveils 80nm SDDI Foundry Process Featuring the Industry's Most Competitive SRAM Bitcell

     UMC Unveils 80nm SDDI Foundry Process Featuring the Industry's Most
                           Competitive SRAM Bitcell

Technology will enable next-generation smartphone displays that feature HD

PR Newswire

HSINCHU, Taiwan, Nov. 21, 2012

HSINCHU, Taiwan, Nov.21, 2012 /PRNewswire/ --United Microelectronics
Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor
foundry, today introduced an 80nm SDDI (Small-panel Display Driver IC) foundry
process with the most competitive SDDI SRAM bitcell in the foundry industry.
The low power, advanced SRAM solution applies aggressive foundry design rules
to shrink the bitcell size down to 0.714 um square to enable HD720/WXGA
smartphone resolutions, far less than the typical 0.81um square ^ size used in
current 80nm SDDI processes. The process is ready for mass production, with
several Tier-1 customers engaged for HD720/WXGA smartphone resolution

Yau Kae Sheu, senior director of UMC's 12-inch Specialty Technology
Development division, said,"With the proliferation of today's smartphones,
UMC has stayed at the forefront of specialty technology development to help
the industry consistently introduce newer, feature-enhanced products. Our
available 80nm and upcoming 55nm SDDI process will help new and existing
display driver customers realize higher resolution with lower power
consumption for upcoming generations of smartphone displays."

The 80nm process leverages UMC's position as the worldwide foundry leader in
SDDI, having shipped over 300 million SDDI chips at 0.13um for today's
mainstream smartphone using WVGA and qHD resolutions. In addition to the
0.13um and 80nm SDDI processes, the foundry is also targeting next generation
smartphone displays featuring full-HD with the industry's first 55nm SDDI
process, which will be ready for customer design-in this quarter.

About UMC

UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that
provides advanced technology and manufacturing for applications spanning every
major sector of the IC industry. UMC's customer-driven foundry solutions allow
chip designers to leverage the company's leading-edge processes, which include
28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed
signal/RFCMOS, and a wide range of specialty technologies. Production is
supported through 10 wafer manufacturing facilities that include two advanced
300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of
Phases 1-4 which are in production for customer products down to 28nm.
Construction is underway for Phases 5&6, with future plans for Phases 7&8. The
company employs over 13,000 people worldwide and has offices in Taiwan, Japan,
Singapore, Europe, and the United States. UMC can be found on the web at

Note From UMC Concerning Forward-Looking Statements

Some of the statements in the foregoing announcement are forward looking
within the meaning of the U.S. Federal Securities laws, including statements
about future outsourcing, wafer capacity, technologies, business relationships
and market conditions. Investors are cautioned that actual events and results
could differ materially from these statements as a result of a variety of
factors, including conditions in the overall semiconductor market and economy;
acceptance and demand for products from UMC; and technological and development
risks. Further information concerning these risks is included in UMC's filings
with the U.S. SEC, including on Form F-1, F-3, F-6 and 20-F, each as amended.

Editorial Contacts:

Richard Yu
+886-2-2658-9168 ext. 16951

SOURCE United Microelectronics Corporation

Press spacebar to pause and continue. Press esc to stop.