ABI Research Teardown: Samsung Drops Qualcomm for Own Chipset in Galaxy SIII E210s – The Start of a Platform War?

  ABI Research Teardown: Samsung Drops Qualcomm for Own Chipset in Galaxy SIII
  E210s – The Start of a Platform War?

Business Wire

AUSTIN, Texas -- November 20, 2012

The Galaxy SIII E210s was released in Korea recently and with its launch,
Samsung sent a message to the chipset giant Qualcomm by dropping the Qualcomm
modem in favor of its home grown solution. Samsung has historically been known
for its high-end application processors that appear in a number of its
smartphones but the modem in its product has typically been supplied by
companies such as Qualcomm, Intel, Broadcom, STE, or Via Telecom.

Samsung LTE/HSPA+ modem (CM221S), Exynos Application processor and Wolfson
Audio hub/codec (WM1811AE ...

Samsung LTE/HSPA+ modem (CM221S), Exynos Application processor and Wolfson
Audio hub/codec (WM1811AE) (Photo: Business Wire)

VP of Engineering, James Mielke, stated that, “Mid last year it introduced a
CDMA/LTE phone that was produced with a Via Telecom CDMA modem, a Samsung LTE
modem, and a Samsung application processor. This combination became popular
for Samsung during the remainder of the year. What makes this variant of the
Galaxy SIII so interesting is the modem is a single chip HSPA/LTE integrated
circuit designed and manufactured by Samsung.”

Key Samsung Galaxy SIII LTE (SHV-E210s) components include:

  *Samsung 2G/3G/4G 40nm modem- CMC221S (same main die as predecessor-
    CMC2200)
  *Samsung Quad core Exynos 4412 application processor
  *Samsung high performance ISP
  *Triquint QuadBand EDGE PA, AVAGO and RFMD 3G PAs
  *Broadcom BCM4334 WiFi/BT/FM single chip
  *Wolfson high performance Audio Hub WM1811AE
  *Knowles Mem microphones
  *STM Gyro and pressure sensor
  *FCI 2G/3G/4G transceiver FC7860
  *Maxim power management

As Samsung continues to capture more share of the smartphone market, Samsung’s
growing reliance upon captive market solutions could prove to be a major
concern for suppliers such as Qualcomm and Via Telecom. This move to
manufacturing its own solutions plus Samsung’s recent purchase of CSR’s
handset business could prove a key turning point that signifies a shift in the
handset component market towards a platform battle between two major
powerhouses of the mobile industry.

ABI Research’s “Samsung Galaxy SIII E210s” report provides detailed photos,
process evaluation, and part descriptions for all of the major components.
Tying all the information together are unique circuit board photos,
performance measurements, processor benchmarks, cost information, and board
area data.

It is one of thousands of devices and components in the firm’s Mobile Device
Teardown (http://www.abiresearch.com/research/service/teardown-services/)
Research Service.

ABI Research provides in-depth analysis and quantitative forecasting of trends
in global connectivity and other emerging technologies. From offices in North
America, Europe and Asia, ABI Research’s worldwide team of experts advises
thousands of decision makers through 70+ research and advisory services. Est.
1990. For more information visit www.abiresearch.com, or call +1.516.624.2500.

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Contact:

ABI Research
Christine Gallen, +1-516-624-2542
pr@abiresearch.com