NXP Achieves Breakthrough in Audio Processing With Industry's First Single-Chip Multi-Tuner Car Radio IC The SAF775x Lowers System Costs, Improves Performance and Reception, and Adds an Open DSP Core for Advanced Audio Applications Such as Noise Cancellation EINDHOVEN, THE NETHERLANDS -- (Marketwire) -- 11/14/12 -- NXP Semiconductors N.V. (NASDAQ: NXPI) -- the world's largest supplier of car entertainment semiconductors -- today introduced the SAF775x, a combined car radio and audio system fully integrated on a single IC. SAF775x is the third generation of NXP's popular car radio and audio DSP product family and is the industry's first single-chip multi-tuner RFCMOS IC with embedded AM, FM, and DAB tuners. With improved audio processing power, the new product achieves excellent reception and performance. At the same time, SAF775x helps to significantly lower system costs via a reduced bill of materials. A few years ago, NXP introduced FM dual-tuner phase diversity in car radio applications, using two tuners for better reception. However, up until now, both tuners were separate devices, external to the DSP chip. This separation was required to avoid interference and because different process technologies were used for analog RF tuners and digital signal processing technologies. With the introduction of the SAF775x, NXP once again managed to set a new milestone in radio processing, by integrating two independent tuners onto a single die and creating a much more compact solution to significantly lower system cost. This integrated dual-tuner device offers more than twice the processing power of previous generations, enabling superior radio performance and better all-round reception quality. Another aspect of the SAF775x is its open programmability. The IC includes an 'open' Tensilica HiFi 2 Audio DSP for customers to program their own features, or to run those of third-party software vendors. This gives car radio manufacturers the choice and flexibility to differentiate their car infotainment solutions without resorting to expensive external ICs. Visteon, a leading Tier1 automotive infotainment supplier, works closely with NXP throughout silicon development to ensure early adoption of NXP tuner and DSP technology. "Visteon is committed to innovative technologies that enhance the in-vehicle entertainment experience," explains Christian Feltgen, global director, Innovation & Technology at Visteon. "Superior sound quality and radio reception are fundamental customer expectations. The addition of an 'open' DSP core enables Visteon to develop exciting, differentiating and customer-focused firmware." Advanced audio processing is another benefit that the new SAF775x brings to the market. Customers may wish to use the HiFi 2 Audio DSP for audio processing from third party vendors such as Arkamys or AM3D. Another innovative application that can run on this HiFi 2 Audio DSP is active noise cancellation of engine sound: uncomfortable harmonics interfering with music playback and the general driving experience are removed by means of audio software processing. In combination with 3rd party software, the SAF775x offers an inexpensive way of damping the unwanted noise and replicating the desirable engine sound. Torsten Lehmann, senior vice president and general manager of car entertainment, NXP Semiconductors, commented, "The SAF775x is a true breakthrough -- no other automotive device has achieved this level of RFCMOS integration, with two tuners working independently on the same chip alongside multiple digital processor cores. This integration lowers the total cost of ownership and dramatically shrinks the application's footprint, while achieving excellent reception and sound performance. We are very pleased that Visteon, a leading Tier1 automotive infotainment supplier, has decided to work with our new SAF775x device." Features -- Dual-Tuner RFCMOS integrated car radio solution -- Multi-standard (incl. DAB bands) frontend -- DSP-based AM/FM radio processing -- Advanced multi-core audio sub-system -- On-chip microcontroller -- Wide range of digital and analog interfaces and I/Os -- Integrated Tensilica HiFi 2 Audio DSP for bespoke customization Availability Samples are available now. Further product information is available at: http://www.nxp.com/products/automotive/am_fm_radio_audio/car_radio_audio_dsp_sol utions/series/SAF775X.html About NXP Semiconductors NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting www.nxp.com. Forward-looking Statements This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov. Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=2153418 Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=2153415 For further information, please contact: Europe: Birgit Ahlborn Tel: +49 170 5746124 Birgit.Ahlborn@nxp.com APAC : Lilian Li Tel: +86 21 22052615 Lilian.Li@nxp.com NA: Melissa Chanslor +1 415 593 8465 MelissaC@text100.com Greater China: Jannet Chen Tel: +86 21 22055883 firstname.lastname@example.org
NXP Achieves Breakthrough in Audio Processing With Industry's
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