Advantest Develops EB Lithography System for 1Xnm Node

  Advantest Develops EB Lithography System for 1Xnm Node

               F7000 Supports Diverse Substrates, Applications

SEMICON Japan 2012 Booth 3D-803 in Hall 3

Business Wire

TOKYO -- November 14, 2012

Advantest Corporation (TSE: 6857, NYSE: ATE) today announced that it has
developed a new EB (electron beam) lithography system, the F7000, with
superior resolution performance meeting the requirements for 1Xnm technology
nodes. The F7000 supports substrates of diverse materials, sizes, and shapes,
including nanoimprint templates as well as wafers, and is optimized for
diverse applications such as advanced LSIs, photonics, MEMS, and other
nano-processes.

EB Lithography System F7000 (Photo: Business Wire)

EB Lithography System F7000 (Photo: Business Wire)

The F7000 will be featured in Advantest’s exhibit (booth #3D-803 in Hall 3) at
the SEMICON Japan trade show, December 5-7 in Makuhari Messe in the Chiba
prefecture. The company plans to launch sales of the new system in the fiscal
year ending March 2014.

A Flexible Next-Generation Lithography Solution

Competition in the mobile electronics and other categories has sparked an
urgent need for chip-makers to develop increasingly low-power, highly
functional semiconductors while reducing TTM (time to market). As a result,
manufacturers are looking to EB lithography, which writes fine-pitch patterns
directly onto wafers, as a method of accelerating cutting-edge semiconductor
R&D processes. Advantest’s new F7000 offers the company’s proven EB technology
in a system capable of writing patterns as fine as 1Xnm. The system also
supports template fabrication for nanoimprint lithography—a technology
positioned to take center stage in next-generation semiconductor
manufacturing.

Product Features

1Xnm Resolution Performance

Advantest has developed a new column technology—key to electron beam writing
accuracy—which delivers resolution performance meeting the needs of
cutting-edge semiconductor R&D at the 1Xnm node.

Supports Substrates of Diverse Sizes, Shapes, & Materials

The F7000’s adjuster function enables it to write to diverse sizes of wafer,
glass substrates, and also square substrates. Moreover, simply by switching
adjusters, the system can support silicon, gallium arsenide, and substrates of
other materials, utilizing separate adjusters for each material to avoid
contamination.

“Lab to Fab” Flexible Configuration

Users can select the configuration optimal for their needs, either stand-alone
or in-line, enabling the F7000 to support a wide array of applications from
R&D to volume production.

High Throughput

With increased current density, the F7000 achieves a write speed fully 5 times
faster than its predecessor model, the F3000.

Small Footprint

The F7000 features a footprint 40% smaller than that of the F3000.


Key Specifications                   
Resolution:                            1Xnm
Substrates supported for lithography:   Wafers (300mm, 200mm, 3-6in.)
                                        Glass substrates (6025)
                                        

About Advantest Corporation

A world-class technology company, Advantest is the leading producer of
automatic test equipment (ATE) for the semiconductor industry and a premier
manufacturer of measuring instruments used in the design and production of
electronic instruments and systems. Its leading-edge systems and products are
integrated into the most advanced semiconductor production lines in the world.
The company also focuses on R&D for emerging markets that benefit from
advancements in nanotech and terahertz technologies, and has recently
introduced multi-vision metrology scanning electron microscopes essential to
photomask manufacturing, as well as a groundbreaking 3D imaging and analysis
tool. Founded in Tokyo in 1954, Advantest established its first subsidiary in
1982, in the USA, and now has subsidiaries worldwide. More information is
available at www.advantest.com.

All information supplied in this release is correct at the time of
publication, but may be subject to change.

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Contact:

Advantest Corporation
Hiroki Yanagita, 03-3214-7500
PR/IR Section
or
Further Inquiries
Nanotechnology Business Group
info_nano@ml.advantest.com