Molex Brings Innovative, High-Performance Interconnect Technology and Expertise to Super Computing 2012

  Molex Brings Innovative, High-Performance Interconnect Technology and
  Expertise to Super Computing 2012

 Company leaders showcase depth of knowledge a range of products/solutions in
                                  booth 3745

SC12

Business Wire

LISLE, Ill. -- November 14, 2012

Molex Incorporated will showcase its proven expertise in high-speed,
high-density and high-signal integrity interconnect technology at Super
Computing 2012, November 12-15 in Salt Lake City, UT. Company leaders will
conduct ongoing product demonstrations in Molex booth 3745.

Products Showcased

Molex will have on display the following high-speed interconnect products and
solutions:

  *25 Gbps QSFP+ Silicon Photonics Based Active Optical Cables: Molex
    recently demonstrated a 100 Gbps QSFP+ Active Optical Cable based on
    silicon photonics single chip transceiver technology enabling next
    generation 100 Gbps optical interconnect applications.
  *Quad Small Form-factor Pluggable (QSFP+) 40 Gbps QDR and 56 Gbps Active
    Optical Cable (AOC) Assemblies: Providing the longest link distance and
    lowest power consumption on the market today, the assemblies achieve 40
    and 56 Gbps data rates over long reaches of up to 4 km (2.49 miles) using
    only 0.78 and 1 W per cable end, respectively.
  *z-Quad Small Form-factor Pluggable Plus (zQSFP+) Interconnect Solution:
    Designed for next-generation high-density applications found in high
    performance computing, telecommunications, data networking, test and
    measurement and medical diagnostic equipment.
  *iPass+™ (HSC) CXP Copper and Optical Systems: Enables twelve channels of
    10 Gbps data for up to 120 Gbps of total bandwidth; with the
    enhanced-footprint integrated connectors enabling ten channels of 10 Gbps
    data, for up to 100 Gbps of total bandwidth.
  *zSFP+ Connector Solutions: Supports 25 Gbps applications, with backward
    compatibility for 10 Gbps Ethernet and 16 Gbps Fibre Channel applications.

Product Demonstration

Molex will demonstrate zQSFP+ stacked thermal management technologies. Wind
tunnel testing has been found to offer the most accurate, repeatable test
method. Data is generated that will support design of NEBS rated applications
with current and next generation pluggable I/O modules.

To receive information on other Molex products and industry solutions, please
sign up for our e-nouncement newsletter at
http://www.molex.com/link/register/.

About Molex Incorporated

Providing more than connectors, Molex delivers complete interconnect solutions
for a number of markets including data communications, telecommunications,
consumer electronics, industrial, automotive, medical, military and lighting.
Established in 1938, the company operates 40 manufacturing locations in 16
countries. The Molex website is http://www.molex.com. Follow us at
http://www.twitter.com/molexconnectors watch our videos at
http://www.youtube.com/molexconnectors, connect with us at
http://www.facebook.com/molexconnectors and read our blog at
http://www.connector.com.

Molex is a registered trademark of Molex Incorporated

Contact:

Outlook Marketing Services
Christa Carroll, 630-922-6995
Christa.carroll@molex.com
or
Molex Incorporated
Larry Wegner, 630-527-2650
Larry.wegner@molex.com