Audi and NXP Announce Strategic Partnership for Automotive

Audi and NXP Announce Strategic Partnership for Automotive Innovation 
Partnership to Drive Innovation Speed and Time to Market in Eight
Automotive Electronics Application Segments 
EINDHOVEN, THE NETHERLANDS, and MUNICH, GERMANY -- (Marketwire) --
11/13/12 --   Audi AG and NXP Semiconductors N.V. (NASDAQ: NXPI)
today announced at electronica 2012 that they have signed a strategic
partnership for innovation. The partnership focuses on innovation
speed and time to market in eight select automotive electronics
application segments ranging from long-established core leadership
positions of NXP's automotive business, such as in-vehicle networking
and car entertainment, to emerging technologies for the connected
car. This includes Car-to-X communications, telematics, Near Field
Communications (NFC), and high-voltage controls for electrical
vehicles.  
"The partnership is another milestone in our Progressive
Semiconductor Program (PSCP) and underscores the mutual trust that
both corporations have built over many years," said Ricky Hudi, Chief
Executive Engineer Electrics/Electronics, Audi. "In addition, NXP's
strategy to provide the electronic interfaces for the connected car
is smart and gives clear indications for Audi's future plans." 
Experts estimate that 90 percent of all innovation in automotive is
enabled by electronics, with semiconductors playing a key role, while
the increasing level of connectivity to the outside world requires a
strong background in adjacent businesses and technologies, such as
NFC, wireless reception, radar, and telematics. Audi and NXP's
collaboration acknowledges the importance of semiconductors in
introducing these and other new functions to the car, with a focus on
achieving new levels of driving safety and comfort, saving costs, and
improving energy efficiency.  
"It's a real honor to serve as a strategic innovation partner to Audi
in the premium car market, and is a testament to the industry
recognizing NXP's excellent customer support, commitment to deliver
top quality solutions, and above all our innovation power," said Kurt
Sievers, general manager, automotive business, NXP. "Our strong
collaboration with Audi reinforces that NXP's focus on technologies
for the connected car is spot on with where the industry is goin
g." 
NXP and Audi's partnership is part of Audi's Progressive
Semiconductor Program (PSCP), the comprehensive semiconductor
strategy aimed at intensifying the role and engagement of
semiconductor companies in the processes of the German car
manufacturer. It is entitled "Role Model of Innovation & Speed" and
was signed in May 2012 by Ricky Hudi of Audi and Kurt Sievers of NXP. 
About NXP Semiconductors
 NXP Semiconductors N.V. (NASDAQ: NXPI)
provides High Performance Mixed Signal and Standard Product solutions
that leverage its leading RF, Analog, Power Management, Interface,
Security and Digital Processing expertise. These innovations are used
in a wide range of automotive, identification, wireless
infrastructure, lighting, industrial, mobile, consumer and computing
applications. A global semiconductor company with operations in more
than 25 countries, NXP posted revenue of $4.2 billion in 2011.
Additional information can be found by visiting www.nxp.com. 
Forward-looking Statements
 This document includes forward-looking
statements which include statements regarding our business strategy,
financial condition, results of operations, and market data, as well
as any other statements which are not historical facts. By their
nature, forward-looking statements are subject to numerous factors,
risks and uncertainties that could cause actual outcomes and results
to be materially different from those projected. These factors, risks
and uncertainties include the following: market demand and
semiconductor industry conditions, our ability to successfully
introduce new technologies and products, the demand for the goods
into which our products are incorporated, our ability to generate
sufficient cash, raise sufficient capital or refinance our debt at or
before maturity to meet both our debt service and research and
development and capital investment requirements, our ability to
accurately estimate demand and match our production capacity
accordingly or obtain supplies from third-party producers, our access
to production from third-party outsourcing partners, and any events
that might affect their business or our relationship with them, our
ability to secure adequate and timely supply of equipment and
materials from suppliers, our ability to avoid operational problems
and product defects and, if such issues were to arise, to correct
them quickly, our ability to form strategic partnerships and joint
ventures and successfully cooperate with our alliance partners, our
ability to win competitive bid selection processes to develop
products for use in our customers' equipment and products, our
ability to successfully establish a brand identity, our ability to
successfully hire and retain key management and senior product
architects; and, our ability to maintain good relationships with our
suppliers. In addition, this document contains information concerning
the semiconductor industry and our business segments generally, which
is forward-looking in nature and is based on a variety of assumptions
regarding the ways in which the semiconductor industry, our market
segments and product areas will develop. We have based these
assumptions on information currently available to us, if any one or
more of these assumptions turn out to be incorrect, actual market
results may differ from those predicted. While we do not know what
impact any such differences may have on our business, if there are
such differences, our future results of operations and our financial
condition could be materially adversely affected. Readers are
cautioned not to place undue reliance on these forward-looking
statements, which speak to results only as of the date the statements
were made. Except for any ongoing obligation to disclose material
information as required by the United States federal securities laws,
we do not have any intention or obligation to publicly update or
revise any forward-looking statements after we distribute this
document, whether to reflect any future events or circumstances or
otherwise. For a discussion of potential risks and uncertainties,
please refer to the risk factors listed in our SEC filings. Copies of
our SEC filings are available from on our Investor Relations website,
http://www.nxp.com/investor or from the SEC website,
http://www.sec.gov. 
Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=2151437 
For further information, please contact: 
Global
Birgit Ahlborn
Europe: 
+49 170 5746124
birgit.ahlborn@nxp.com 
GC: 
Lilian Li
+86 21 22052615
lilian.li@nxp.com  
NA: 
Melissa Chanslor
+1 415 593 8465
MelissaC@text100.com 
APAC:
Preeti Gupta
+65 6603 9022
preeti.gupta@text100.com.sg 
 
 
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