ANSYS® 14.5 Bolsters Product Performance and Integrity Through Deeper Design Insight

 ANSYS® 14.5 Bolsters Product Performance and Integrity Through Deeper Design
                                   Insight

New technology enhancements combined with ANSYS Workbench™ deliver engineering
productivity and innovation through unprecedented multiphysics analyses and
HPC capabilities

PR Newswire

PITTSBURGH, Nov. 13, 2012

PITTSBURGH, Nov. 13, 2012 /PRNewswire/ -- Building upon its comprehensive
portfolio of advanced multiphysics engineering simulation technology, ANSYS
(NASDAQ: ANSS) today released version 14.5 to further support an integrated
and streamlined approach to design exploration and the creation of a complete
virtual prototype. New multiphysics capabilities are seamlessly brought
together with the ANSYS Workbench platform to deliver unmatched engineering
productivity and innovation.

(Logo: http://photos.prnewswire.com/prnh/20110127/MM38081LOGO )

In the real world, product performance varies by operating conditions,
consumer usage, manufacturing processes and material properties. As products
become increasingly complex, it is more challenging for engineers to fully
understand the performance implications of design variations. Multiphysics
simulation technology enables companies to make informed decisions based on
insight gained from these analyses to deliver optimal results. Built on a
platform that streamlines workflow among simulation applications, ANSYS 14.5
delivers many new and critical multiphysics solutions, enhancements to
pre-processing and meshing capabilities as well as a new parametric
high-performance computing (HPC) licensing model to make design exploration
more scalable.

"It's no secret that while today's products are getting smarter, they're also
becoming more complex," said Jim Cashman, president and CEO at ANSYS. "Having
a holistic view of the product requirements and design is crucial to reduce
design uncertainty and ultimately create a successful product. Our customers
are depending on the depth and breadth of ANSYS 14.5 and our Workbench
platform to confidently predict how their products will perform and, at the
end of the day, provide good value and satisfaction to  their customers."

NEW PARAMETRIC LICENSING SOLUTIONS FOR DESIGN EXPLORATION
ANSYS 14.5 builds on a tradition of HPC leadership. The technology supports
robust design exploration via a combination of Workbench's enhanced parametric
simulation technology with improved job management and a new HPC licensing
solution that enables scalable throughput computing.

Specifically, the new HPC Parametric Pack amplifies the available licenses for
individual applications (pre-processing, meshing, solve, HPC,
post-processing), enabling simultaneous execution of multiple design points
while consuming just one set of application licenses.

CHIP–PACKAGE–SYSTEM DESIGN FLOW
To meet increasing market demands of higher performance, smaller size and
lower-cost electronics, the design of electronic chips, packages and systems
requires an integrated analysis and verification methodology. To resolve these
challenges, ANSYS 14.5 introduces the first chip–package–system (CPS) design
flow on the market. This coupled approach addresses multidisciplinary
requirements from the first phase of the design process and results in a final
product whose individual components work together as an integrated system.

ANSYS 14.5's new CPS design flow links ANSYS subsidiary Apache Design's
integrated circuit (IC) power analysis products to ANSYS' electromagnetic
field simulation products. Additionally, the power delivery network channel
builder automatically connects electronic package models from ANSYS SIwave™ to
IC power simulations in Apache's RedHawk™ and Totem™ for increased
convenience.

ADVANCED MESHING SOLUTIONS
Users of ANSYS 14.5 can create higher-fidelity simulation results faster.
ANSYS TGrid™ functionalities are integrated in the ANSYS Fluent^® environment
in version 14.5 to further reduce pre-processing time. CAD readers and new
advanced surface meshing capabilities are also integrated and available in a
single user environment. Additionally, meshing enhancements allow for
higher-quality hexahedral meshes that result in smaller problem size and
overall reduced solver time.

COMPLEX 3-D COMPOSITES SHAPE SIMULATION
The use of composites  parts across different industries is growing due to
their ability to reduce the weight of a product. While many composites can be
efficiently modeled as thin structures, some complex geometries, such as
turbine blades, pressure vessels and automotive structures, require the setup
of 3-D models and their inclusion within larger assemblies made of
non-composites parts. ANSYS Workbench provides the necessary framework and
streamlined workflow in version 14.5 to further improve the ability to create
3-D layered composites from complex geometry and conveniently combine them
with non-composites parts in global assemblies.

EXTENDED FLUID–THERMAL MULTIPHYSICS CAPABILITIES
Continuing its history of innovation in multiphysics, ANSYS 14.5 introduces
extended fluid–thermal capabilities, such as two-way coupling between fluid
simulation in ANSYS Fluent and electromagnetic field simulation in ANSYS
Maxwell^®. The ANSYS Workbench platform supports the efficient coupling of
multiple physics models and, when paired with this new feature, users can
quickly and accurately predict losses and understand the effects of
temperature on material performance in electromechanical devices such as
motors and transformers.

A holistic solution for one-way thermal–fluid–structure interaction (FSI),
ANSYS system coupling supports a wide variety of one-way thermal FSI
workflows, which promotes higher-fidelity simulations. Furthermore, the
robustness of coupled two-way force/displacement FSI is enhanced, allowing
engineers to gain insight into their complete products more quickly and with
less hassle. A global liquid food packaging and processing leader, Tetra Pak,
has seen marked improvements with 14.5's new two-way FSI capabilities:

"Historically, simulating two-way FSI has been an incredibly time-consuming
and complex process and, in some applications, not even possible," said Ulf
Lindblad, technology specialist at Tetra Pak. "The solution stabilization
algorithm implemented in ANSYS 14.5 broadens the range of applications where
we can execute this difficult task with increased accuracy and efficiency.
Designing our systems with optimized FSI will ultimately lead to improved
machine performance for our customers and improved package performance for
their consumers."

ESTEREL TECHNOLOGIES SCADE SUITE^® COUPLING WITH ANSYS SIMPLORER^®
A systems-level engineering approach that brings hardware and software
together earlier in the design process is crucial to avoiding design errors
being introduced at a point when changes are costly.

With the integration of recently acquired ANSYS subsidiary Esterel
Technologies' SCADE Suite with ANSYS Simplorer in version 14.5, companies can
virtually validate power electronic and mechatronic systems earlier in the
design process by simulating the embedded software with the hardware,
including electrical, mechanical and fluidic subsystems. This capability
increases the design fidelity and boosts confidence that products will perform
as expected in the real world.

ANSYS HFSS™ FOR ECAD INTEGRATION
As companies face pressure to do more with their current engineering
resources, ANSYS 14.5 further streamlines the design workflow and introduces
ANSYS HFSS for ECAD. This capability contributes to accuracy by enabling
engineers to run complex 3-D HFSS simulations directly from the ANSYS Designer
^ layout-based interface and from other popular layout-based ECAD
environments.

Scott McMorrow, director of engineering at Teraspeed Consulting Group LLC, has
chosen to switch to ANSYS HFSS, ANSYS DesignerSI™ and SIwave after using a
competitor's electromagnetic modeling and simulation products for nearly 10
years. "After a two-year extensive evaluation and measurement correlation of
the ANSYS tools against multiple industry products, the measurement
comparisons have shown that the ANSYS solutions are robust and accurate across
the widest range of applications and structures. We found through detailed
measurement testing that HFSS is truly the 'golden standard' in
electromagnetic modeling. When the structures we measured were modeled
faithfully and the material properties were characterized and entered
accurately, ANSYS HFSS produced extremely accurate results with no discernible
difference between measured and modeled results."

ANSYS version 14.5 is available for download via the ANSYS Customer Portal:
https://www1.ansys.com/customer/default.asp

Related images are available for download by the media at:
http://www.ansys.com/newsimages

About ANSYS, Inc.

ANSYS brings clarity and insight to customers' most complex design challenges
through fast, accurate and reliable engineering simulation. Our technology
enables organizations ― no matter their industry ― to predict with confidence
that their products will thrive in the real world. Customers trust our
software to help ensure product integrity and drive business success through
innovation. Founded in 1970, ANSYS employs approximately 2,400 professionals,
many of them expert in engineering fields such as finite element analysis,
computational fluid dynamics, electronics and electromagnetics, and design
optimization. Headquartered south of Pittsburgh, U.S.A., ANSYS has more than
65 strategic sales locations throughout the world with a network of channel
partners in 40+ countries. Visit www.ansys.com for more information.

ANSYS and any and all ANSYS, Inc. brand, product, service and feature names,
logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or
its subsidiaries in the United States or other countries.  All other brand,
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respective owners.

Technology: ANSS-T

                  Jackie Mavin

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Contact Media
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                  Annette Arribas
        Investors
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SOURCE ANSYS, Inc.

Website: http://www.ansys.com