Deca Technologies Unveils M-Series(TM) CSP With Adaptive

Deca Technologies Unveils M-Series(TM) CSP With Adaptive
Patterning(TM) 
A Unique Design for Every Device 
TEMPE, AZ -- (Marketwire) -- 11/07/12 --  Deca Technologies, an
electronic interconnect solutions provider to the semiconductor
industry, today announced the introduction of the new M-Series(TM)
CSP product line featuring Adaptive Patterning(TM). M-Series is a
rugged, fully molded packaging technology that provides popular ball
grid array (BGA) style formats while eliminating the need for
laminate substrates. Adaptive Patterning is a technology that
dynamically creates and implements a unique design for each device
during the manufacturing process to adapt for the typical die shift
associated with embedded device packaging. 
One year ago, Deca Technologies (Deca) announced its unique wafer
level processes, inspired by SunPower Corp. (NASDAQ: SPWR), and the
first technology application on wafer level chip scale packaging
(WLCSP). Today, Deca adds the M-Series platform of embedded die
packaging as the second major product offering. M-Series offers
semiconductor designers and system architects a high-performance,
cost-effective, miniaturized packaging solution.  
"Industry response to the speed, value and flexibility of Deca's
unique capabilities on our initial offering of WLCSP has been very
strong. Multiple customers are in production and many more are
undergoing qualification," commented Tim Olson, president and CEO,
Deca Technologies. "However, where WLCSP doesn't fit the application,
M-Series and our revolutionary Adaptive Patterning technology step in
to provide a unique solution." 
Adaptive Patterning is Deca's proprietary design and patterning
process that allows features such as vias and redistribution traces
to dynamically align to shifting die within an embedded device
structure. Through the unique integration of a fixed design pattern
with an adaptive region, the methodology resembles the
characteristics of classic wirebonding, yet is realized through a
wafer-level build-up flow. With the addition of a dimensional
inspection step and processing through our automated design software,
Deca is able to create a unique design for every device within a
molded panel, thereby removing the classic barrier of a
cost-effective embedded flow. 
Deca is currently sampling M-Series to a limited set of customers
with broader availability planned for 2013. 
About Deca Technologies 
Founded in 2009 and launched in November 2011, Deca Technologies is
an electronic interconnect solutions provider offering wafer level
packaging (WLP) services to the semiconductor industry. Headquartered
in Tempe, AZ and with global capabilities, Deca is a majority-owned
and fully independent subsidiary of Cypress Semiconductor Corp.
(NASDAQ: CY). Deca's mission is to deliver an exceptional customer
experience through its proprietary and transformative interconnect
technology. 
Integrating its solar and semiconductor background, Deca leverages
unique equipment, processes and operational methods to break down
traditional barriers in the continued adoption and growth of next
generation wafer level electronic interconnect. 
For more information, please visit http://www.decatechnologies.com 
The Deca Technologies logo, M-Series(TM) and Adaptive Patterning(TM)
are trademarks of Deca Technologies. All other trademarks are the
property of their respective owners. 
CONTACTS 
Company Contact 
Lori McDonald
Deca Technologies
Tel + 1 480 345 9895 x10
lori.mcdonald@decatechnologies.com 
Media Enquiries 
Martijn Pierik
Impress Labs
Tel + 1 602 366 5599
martijn@impresslabs.com