Photo Release -- Alpha and Omega Semiconductor Features New Ground Exposed Die Pad Power IC Platform SUNNYVALE, Calif., Nov. 6, 2012 (GLOBE NEWSWIRE) -- Alpha and Omega Semiconductor Limited (AOS) (Nasdaq:AOSL), a designer, developer and global supplier of a broad range of power semiconductors, today introduced its new Ground Exposed Die Pad Power IC platform, an innovative packaging technology capable of exceptional power dissipation. The high performance of this EZBuck™ dc/dc platform is attributed to a combination of IC design, low on-resistance MOSFET technology, and proprietary exposed ground pad packaging technology. The new platform enables more thermally efficient dc/dc solutions for consumer, networking and industrial applications such as LCD TVs, set-top boxes, cable modems, and power supplies. Ground Exposed Die Pad A photo accompanying this release is available at http://www.globenewswire.com/newsroom/prs/?pkgid=15590 The ground exposed die pad platform combines a current-mode step-down controller IC with integrated high-side and low-side MOSFETs. The vertical MOSFET structure features outstanding on-resistance performance which allows more power delivery in a small area, while the exposed ground pad transfers heat directly to the printed circuit board's ground plane which acts as a large heat sink. Another benefit of the large ground exposed pad is that it reduces electromagnetic interference and noise coupling into the system. The high-side p-channel MOSFET and low-side n-channel MOSFET with integrated Schottky diode, combined with a bond-wireless packaging technology deliver best-in-class junction temperature performance for a 30W, 12V to 5V post-regulating application. "The integration of the discrete FET technology and the exposed ground pad are significant features for future EZBuck products, which will offer higher power density without the added cost," said Daniel Chang, Vice President of Power IC at AOS. Availability The first EZBuck products with the new featured platform will be available within the first quarter of 2013. About AOS Alpha and Omega Semiconductor Limited, or AOS, is a designer, developer and global supplier of a broad range of power semiconductors, including a wide portfolio of Power MOSFET, IGBT and Power IC products. AOS has developed extensive intellectual property and technical knowledge that encompasses the latest advancements in the power semiconductor industry. AOS differentiates itself by integrating its Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high performance power management solutions. AOS's portfolio of products targets high-volume applications, including portable computers, flat panel TVs, LED lighting, smart phones, battery packs, consumer and industrial motor controls and power supplies for TVs, computers, servers and telecommunications equipment. For more information, please visit www.aosmd.com. Forward Looking Statements This press release contains forward-looking statements that are based on current expectations, estimates, forecasts and projections of future performance based on management's judgment, beliefs, current trends and anticipated product performance. These forward-looking statements include, without limitation, references to the efficiency and capability of new products, and the potential to expand into new markets. Forward looking statements involve risks and uncertainties that may cause actual results to differ materially from those contained in the forward-looking statements. These factors include, but are not limited to, the actual product performance in volume production, the quality and reliability of the product, our ability to achieve design wins, the general business and economic conditions, the state of the semiconductor industry, and other risks as described in the Company's annual report and other filings with the U.S. Securities and Exchange Commission. Although the Company believes that the expectations reflected in the forward looking statements are reasonable, it cannot guarantee future results, level of activity, performance, or achievements. You should not place undue reliance on these forward-looking statements. All information provided in this press release is as of today's date, unless otherwise stated, and AOS undertakes no duty to update such information, except as required under applicable law. CONTACT: Martha Aparicio 408-789-3233 email@example.com Alpha and Omega Semiconductor Logo
Photo Release -- Alpha and Omega Semiconductor Features New Ground Exposed Die Pad Power IC Platform
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