Cadence Encounter Technologies Enable Open-Silicon to Reach 2.2 GHz
Performance on 28nm ARM Dual-Core Cortex-A9 Processor
Open-Silicon Gets Breakthrough Performance While Making Significant
Power, Area and Time-to-Market Improvements
BANGALORE, INDIA -- (Marketwire) -- 11/06/12 -- Cadence Design
Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design
innovation, today announced that Open-Silicon, Inc., a leading
semiconductor design and manufacturing company, has leveraged the
latest innovations from the Cadence(R) Encounter(R) RTL-to-signoff
flow to achieve 2.2 GHz performance on a 28-nanometer hardening of an
ARM(R) dual-core Cortex(TM)-A9 processor.
Open-Silicon used the latest Encounter digital RTL-to-signoff
products for the processor core which is targeted for mobile
computing applications, including RTL Compiler-Physical (RC-Physical)
and Encounter Digital Implementation (EDI) System. EDI System
features advanced GigaOpt optimization and Clock Current Optimization
(CCOpt) technologies, which, together with RC-Physical, helped reduce
the design area by 10 percent, clock tree power by 33 percent and
overall leakage power by 27 percent compared to a prior flow, while
accelerating design closure by two weeks.
Open-Silicon's chips go into leading-edge products where power,
performance, and area (PPA), and time-to-parts are paramount.
Open-Silicon's extensive experience with processor implementations
across many verticals, including networking/telecom, storage and
computing, enables turnkey ARM technology-based SoC design. By
leveraging the Center of Excellence (CoE) for ARM Technology-based
Designs at Open-Silicon and Cadence optimized RTL-to-signoff flows,
customers are now able to achieve market-differentiating performance
and power efficiencies in their ARM technology-based products.
"Improving designer productivity and time-to-market are absolutely
critical to Open-Silicon's rapid execution of SoC development. The
predictability of the Cadence RTL-to-Sign-off flow, which includes
excellent convergence from RC-Physical to EDI System and Encounter
Timing System (ETS) for sign-off, has enhanced Open-Silicon's
competitive advantage in delivering industry-leading ARM
processor-based SoC designs," said Taher Madraswala,
president of engineering at Open-Silicon. "Achieving 2.2 GHz under
typical conditions on the ARM dual-core Cortex-A9 processor at
advanced nodes and in a short turn-around time is a testament to
Open-Silicon and Cadence's capabilities and collaborative efforts.
The PPA and runtime improvement as a result of adopting Encounter
GigaOpt and CCOpt technologies in our CoE chip design flows is a real
The Cadence Encounter RTL-to-signoff flow has been significantly
optimized for ARM processor-based design, helping design teams
optimize PPA for the world's most advanced high-performance, and
power efficient designs. The flow includes Encounter RC-Physical, EDI
System, and signoff-proven Cadence QRC Extraction, and ETS. The new
GigaOpt technology inside EDI System produces high-quality results
faster than traditional optimization engines by harnessing the power
of multiple CPUs. In addition, the integrated CCOpt technology
unifies clock tree synthesis with logic/physical optimization
resulting in significant PPA improvements.
As a result of this success, Open-Silicon has standardized on the
Encounter RTL-to-signoff flow in its CoE for hardening
high-performance ARM technology-based SoCs.
"We congratulate Open-Silicon on this significant achievement, and
thank them for partnering with Cadence to optimize PPA for the
world's most sophisticated and complex ARM processor-based designs,"
said Dr. Chi-Ping Hsu, senior vice president, research and
development, Silicon Realization Group at Cadence. "In collaboration
with our partners, Cadence is focused intently on enabling customers
to implement high-performance processors that power many of today's
popular electronic products."
Cadence enables global electronic design innovation
and plays an essential role in the creation of today's integrated
circuits and electronics. Customers use Cadence software, hardware,
IP, and services to design and verify advanced semiconductors,
consumer electronics, networking and telecommunications equipment,
and computer systems. The company is headquartered in San Jose,
Calif., with sales offices, design centers, and research facilities
around the world to serve the global electronics industry. More
information about the company, its products, and services is
available at www.cadence.com.
For more information please contact:
Cadence Design Systems, Inc.
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