NXP IQ Modulators Feature Highest Dynamic Range With

NXP IQ Modulators Feature Highest Dynamic Range With DC-Independent
DAC Interfacing 
High Linearity and Low Noise 5V Wideband IQ Modulators Also Feature
Lowest Power Consumption and Excellent Switching Performance for TDD
EINDHOVEN, THE NETHERLANDS -- (Marketwire) -- 10/31/12 --   NXP
Semiconductors N.V. (NASDAQ: NXPI) today announced two 5V wideband IQ
modulator devices that combine high dynamic range with fast on/off
switching performance for use in radio frequency up-conversion.
Operating between 400 MHz and 4 GHz, the BGX7100 and BGX7101 consume
less than 1 W power -- 10-percent more efficient than other solutions
on the market today. Because RF performance is independent of input
common mode voltage, these modulators offer flexible interfacing with
any DAC, simplifying design-in, and lowering the bill of materials. A
video demonstration of NXP's IQ modulators is available here:
Applications of the rugged BGX710x series are in wireless
infrastructure base stations, and repeaters for standards such as
GSM, W-CDMA, TD-SCDMA and LTE, as well as in point-to-point systems.
The main difference between the two NXP IQ modulators is in output
power: 0 dBm for BGX7100HN, and 4 dBm for BGX7101HN, providing
solutions for infrastructure cell sizes ranging from small to macro.
Next to the high dynamic range and low noise floor, the devices excel
in monotonic IP3o behavior versus frequency, in the lowest unadjusted
carrier feedthrough (-50 dBm at -7 dBm output power @ 1960 MHz) and
in the highest unadjusted sideband suppression in the market (45 dBc
at -7 dBm output power @ 1960 MHz). The devices' wide temperature
range (-40 degrees  to 85 degrees C) makes them well-suited for
operation under extreme weather conditions. 
A unique feature of the BGX710x series is the fast on/off switching
that enables the device to go from power-saving mode to full-spec
operation and stable RF performance within 1 microsecond, even for
the most demanding Time Division Duplex (TDD) systems. This results
in power consumption savings of more than 50 percent.  
"Tomorrow's wireless infrastructure systems need technology that
enables high RF performance, while still being cost-effective and
low-power. Customers who have tested our modulators confirm that 
dynamic range and linearity results are superb. The devices'
insensitivity to input common mode voltage has enabled savings on our
customers' bill of materials. Moreover, the fast on/off switching
capability of less than 1 microsecond makes our modulators the
preferred choice for TTD systems," said Robbert van der Waal,
director of marketing, NXP Semiconductors. "These IQ modulators are
great examples of how NXP can free RF designs of performance barriers
and help our customers meet the most demanding system
 The BGX7100HN and BGX7101HN are
available now. NXP is displaying the products at European Microwave
Week in Amsterdam. 

--  VIDEO: NXP IQ modulators: High dynamic range, fast switching:
--  BGX7100 product information: http://www.nxp.com/pip/BGX7100HN
--  BGX7101 product information: http://www.nxp.com/pip/BGX7101HN

About NXP Semiconductors
 NXP Semiconductors N.V. (NASDAQ: NXPI)
provides High Performance Mixed Signal and Standard Product solutions
that leverage its leading RF, Analog, Power Management, Interface,
Security and Digital Processing expertise. These innovations are used
in a wide range of automotive, identification, wireless
infrastructure, lighting, industrial, mobile, consumer and computing
applications. A global semiconductor company with operations in more
than 25 countries, NXP posted revenue of $4.2 billion in 2011.
Additional information can be found by visiting www.nxp.com. 
Forward-looking Statements
 This document includes forward-looking
statements which include statements regarding NXP's business
strategy, financial condition, results of operations, and market
data, as well as any other statements which are not historical facts.
By their nature, forward-looking statements are subject to numerous
factors, risks and uncertainties that could cause actual outcomes and
results to be materially different from those projected. These
factors, risks and uncertainties include the following: market demand
and semiconductor industry conditions; the ability to successfully
introduce new technologies and products; the end-market demand for
the goods into which NXP's products are incorporated; the ability to
generate sufficient cash, raise sufficient capital or refinance
corporate debt at or before maturity; the ability to meet the
combination of corporate debt service, research and development and
capital investment requirements; the ability to accurately estimate
demand and match manufacturing production capacity accordingly or
obtain supplies from third-party producers; the access to production
capacity from third-party outsourcing partners; any events that might
affect third-party business partners or NXP's relationship with them;
the ability to secure adequate and timely supply of equipment and
materials from suppliers; the ability to avoid operational problems
and product defects and, if such issues were to arise, to correct
them quickly; the ability to form strategic partnerships and joint
ventures and to successfully cooperate with alliance partners; the
ability to win competitive bid selection processes to develop
products for use in customers' equipment and products; the ability to
successfully establish a brand identity; the ability to successfully
hire and retain key management and senior product architects; and,
the ability to maintain good relationships with our suppliers. In
addition, this document contains information concerning the
semiconductor industry and NXP's business segments generally, which
is forward-looking in nature and is based on a variety of assumptions
regarding the ways in which the semiconductor industry, NXP's market
segments and product areas may develop. NXP has based these
assumptions on information currently available, if any one or more of
these assumptions turn out to be incorrect, actual market results may
differ from those predicted. While NXP does not know what impact any
such differences may have on its business, if there are such
differences, its future results of operations and its financial
condition could be materially adversely affected. Readers are
cautioned not to place undue reliance on these forward-looking
statements, which speak to results only as of the date the statements
were made. Except for any ongoing obligation to disclose material
information as required by the United States federal securities laws,
NXP does not have any intention or obligation to publicly update or
revise any forward-looking statements after we distribute this
document, whether to reflect any future events or circumstances or
otherwise. For a discussion of potential risks and uncertainties,
please refer to the risk factors listed in our SEC filings. Copies of
our SEC filings are available from on our Investor Relations website,
www.nxp.com/investor or from the SEC website, www.sec.gov. 
Embedded Video Available: 
Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=2138067 
For further press information, please contact: 
NXP Semiconductors 
Eureka Endo 
+44 795 828 7483
GC : 
Jannet Chen
+86 21 22055883 
sa Chanslor
+1 415 593 8465
Preeti Gupta
+65 6603 9022
Press spacebar to pause and continue. Press esc to stop.