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The Industrial & Commercial Bank of China Selects NXP's

The Industrial & Commercial Bank of China Selects NXP's SmartMX2 for
Secure and Fast Banking Card Transactions 
EINDHOVEN, THE NETHERLANDS -- (Marketwire) -- 10/25/12 --  NXP
Semiconductors N.V. (NASDAQ: NXPI) today announced that the world's
largest bank, the Industrial & Commercial Bank of China (ICBC), has
selected its SmartMX2 high security microcontroller to increase the
security and performance of its banking cards. The new cards will
have dual interface capabilities that will enable both contact and
contactless payments.  
The high performance of the SmartMX2(TM) means that banking cards
will deliver exceptional user convenience and speed of transactions
allowing banks to offer multiple applications all on one card -- for
instance, additionally supporting public transport ticketing,
providing physical access or government ID. They will also work
seamlessly with the contactless infrastructure rapidly being put in
place in the country, which is mostly based on NXP technology. ICBC
plans to introduce its new cards in 2013 in a bid to improve security
and reduce fraud rate. 
In addition to banking or credit cards, NXP's SmartMX technology is
used in eGovernment applications such as ePassports, citizen cards,
electronic health cards and electronic ID cards, plus in public
transport smart cards and in NFC-enabled mobile devices, representing
one element of an end-to-end security system. NXP has shipped more
than one billion SmartMX chips, including 86 out of the 102 countries
with ePassport projects. 
"As security and performance were the two biggest criteria for ICBC's
project, ICBC selected our solution after evaluating international
and local vendors," said Ulrich Huewels, vice president and general
manager, business line card security with NXP Semiconductors. "Our
SmartMX2 technology delivers proven security as well as
industry-leading transaction times. Combined with the ensured
interoperability with POS devices and ATMs across the world, SmartMX2
provides the best combination of security and performance available
in the market."  
Based on trusted security, a complete product portfolio and the best
contactless performance, NXP is the leader in the overall ID market
as well as in key market segments such as transport ticketing,
eGovernment, access, i
nfrastructure, RFID/Authentication, payments
and NFC. NXP provides the entire ID market with end-to-end solutions,
enabling customers to create trusted solutions for a smarter life. 
Visitors to CARTES 2012 (Paris, Nov. 6 - 8) can see NXP's SmartMX(TM)
technology in multiple solutions developed to authenticate identities
and secure transactions (booth 4J 035, Hall 4). 
About NXP Semiconductors 
 NXP Semiconductors N.V. (NASDAQ: NXPI)
provides High Performance Mixed Signal and Standard Product solutions
that leverage its leading RF, Analog, Power Management, Interface,
Security and Digital Processing expertise. These innovations are used
in a wide range of automotive, identification, wireless
infrastructure, lighting, industrial, mobile, consumer and computing
applications. A global semiconductor company with operations in more
than 25 countries, NXP posted revenue of $4.2 billion in 2011.
Additional information can be found by visiting www.nxp.com. 
Note to Editors
 SmartMX2 and SmartMX are trademarks of NXP
Semiconductors. All other brands or product names are property of
their respective holders. 
Forward-looking Statements
 This document includes forward-looking
statements which include statements regarding our business strategy,
financial condition, results of operations, and market data, as well
as any other statements which are not historical facts. By their
nature, forward-looking statements are subject to numerous factors,
risks and uncertainties that could cause actual outcomes and results
to be materially different from those projected. These factors, risks
and uncertainties include the following: market demand and
semiconductor industry conditions, our ability to successfully
introduce new technologies and products, the demand for the goods
into which our products are incorporated, our ability to generate
sufficient cash, raise sufficient capital or refinance our debt at or
before maturity to meet both our debt service and research and
development and capital investment requirements, our ability to
accurately estimate demand and match our production capacity
accordingly or obtain supplies from third-party producers, our access
to production from third-party outsourcing partners, and any events
that might affect their business or our relationship with them, our
ability to secure adequate and timely supply of equipment and
materials from suppliers, our ability to avoid operati
onal problems
and product defects and, if such issues were to arise, to correct
them quickly, our ability to form strategic partnerships and joint
ventures and successfully cooperate with our alliance partners, our
ability to win competitive bid selection processes to develop
products for use in our customers' equipment and products, our
ability to successfully establish a brand identity, our ability to
successfully hire and retain key management and senior product
architects; and, our ability to maintain good relationships with our
suppliers. In addition, this document contains information concerning
the semiconductor industry and our business segments generally, which
is forward-looking in nature and is based on a variety of assumptions
regarding the ways in which the semiconductor industry, our market
segments and product areas will develop. We have based these
assumptions on information currently available to us, if any one or
more of these assumptions turn out to be incorrect, actual market
results may differ from those predicted. While we do not know what
impact any such differences may have on our business, if there are
such differences, our future results of operations and our financial
condition could be materially adversely affected. Readers are
cautioned not to place undue reliance on these forward-looking
statements, which speak to results only as of the date the statements
were made. Except for any ongoing obligation to disclose material
information as required by the United States federal securities laws,
we do not have any intention or obligation to publicly update or
revise any forward-looking statements after we distribute this
document, whether to reflect any future events or circumstances or
otherwise. For a discussion of potential risks and uncertainties,
please refer to the risk factors listed in our SEC filings. Copies of
our SEC filings are available from on our Investor Relations website,
http://www.nxp.com/investor or from the SEC website,
http://www.sec.gov. 
Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=2133149 
For further information, please contact: 
Global/EMEA:
Michael Maader
+49 (0)40 5613 3371
michael.maader@nxp.com 
NA:
Melissa Chanslor
+1 415 593 8465
MelissaC@text100.com 
GC :
Lilian Li
+86 21 22052615
lilian.li@nxp.com 
APAC:
Preeti Gupta
+65 6603 9022
preeti.gupta@text100.com.sg 
 
 
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