ANSYS and Subsidiary Apache Design Selected for TSMC Reference Flows

     ANSYS and Subsidiary Apache Design Selected for TSMC Reference Flows

Engineering Simulation Solutions Support TSMC's 20nm and CoWoS™ Reference
Flows

PR Newswire

PITTSBURGH, Oct. 15, 2012

PITTSBURGH, Oct. 15, 2012 /PRNewswire/ --To meet market demands for low-power
mobile, high-performance computing and consumer and automotive electronics,
ANSYS (NASDAQ: ANSS) and subsidiary Apache announce that their simulation
tools have been selected for TSMC's 20-nanometer (20nm) Reference Flow and
CoWoS^TM (Chip on Wafer on Substrate) Reference Flow to meet power, noise and
reliability requirements for ensuring timely and successful tape-out results.

(Logo:http://photos.prnewswire.com/prnh/20110127/MM38081LOGO )

As part of the TSMC 20nm Reference Flow, Apache made needed enhancements in
its RedHawk™ tool to provide IR-drop and electromigration (EM) analysis based
on 20nm process requirements such as current direction and power grid rule of
DC EM.

TSMC's CoWoS™ Reference Flow spans a suite of tools from ANSYS and Apache to
manage thermal impact on 3D-IC structures, such as thermal run-away, stress
and thermal-induced electromigration. RedHawk, Totem, Chip Thermal Model
(CTM™) and Sentinel™-TI, along with ANSYS® SIwave™ and ANSYS Icepak®, provide
complete system-level thermal analysis with consideration for chip behavior
across CoWoS™ designs. Another key advantage of 3D-IC packaging is the support
for Wide-I/O architecture, which enables the design of products with lower
power and higher bandwidth data communication. The CoWoS™ Reference Flow
includes Sentinel™-SSO interposer-based I/O jitter and timing simulation with
package and board models extracted from SIwave, providing designers with
accurate and early visibility of their chip's performance.

"ANSYS and Apache solutions address power, noise and reliability challenges
for the most advanced TSMC process nodes and emerging design technologies,"
said Andrew Yang, president of Apache. "Our continued collaboration with TSMC
enables us to provide optimized tools and methodologies for 20nm and CoWoS™
designs."

"Using ANSYS and Apache solutions, customers will have the ability to produce
more robust designs and quickly deliver their next-generation products to the
marketplace with TSMC's 20nm and CoWoS™ technologies," said Suk Lee, TSMC
senior director, design infrastructure marketing division.

To learn more about the broad portfolio of engineering simulation product
offerings, visit ANSYS and Apache exhibiting at the TSMC Open Innovation
Platform® Ecosystem Forum October 16 in San Jose, Calif. Apache will present
"Verification of Power, Signal and Reliability Integrity for 3D-IC/Silicon
Interposer Designs" during the EDA technical track.

About Apache Design, Inc.
Apache Design, an ANSYS subsidiary, enables simulation-driven IC and
electronic systems design by providing advanced chip-level power analysis,
optimization, and sign-off solutions. Apache's integrated products and
methodologies advance low-power innovation and address chip-package-system
power and noise challenges. Using Apache's engineering simulation software
early in the design and throughout the process enables the world's top
semiconductor companies to gain a competitive advantage delivering more
power-efficient, high-performance, and noise immune chips. Apache's products
help lower power consumption, increase operating performance, mitigate design
risks, reduce system cost, and shorten time-to-market for a broad range of
end-markets and applications. Learn more at:http://www.apache-da.com/.

About ANSYS, Inc.
ANSYS brings clarity and insight to customers' most complex design challenges
through fast, accurate and reliable engineering simulation. Our technology
enables organizations ― no matter their industry ― to predict with confidence
that their products will thrive in the real world. Customers trust our
software to help ensure product integrity and drive business success through
innovation. Founded in 1970, ANSYS employs more than 2,300 professionals, many
of them expert in engineering fields such as finite element analysis,
computational fluid dynamics, electronics and electromagnetics, and design
optimization. Headquartered south of Pittsburgh, U.S.A., ANSYS has more than
65 strategic sales locations throughout the world with a network of channel
partners in 40+ countries. Visit www.ansys.com for more information.

ANSYS and any and all ANSYS, Inc. brand, product, service and feature names,
logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or
its subsidiaries in the United States or other countries.  All other brand,
product, service and feature names or trademarks are the property of their
respective owners.

General: ANSS-G

Contact Media     Yukari Ohno
                  408.457.2000
                  yukari.ohno@ansys.com
                  Jackie Mavin
                  724.514.3053
                  Jackie.mavin@ansys.com
        Investors Annette Arribas
                  724.514.1782
                  annette.arribas@ansys.com

SOURCE ANSYS, Inc.

Website: http://www.ansys.com