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Microsemi Introduces Next-generation SmartFusion®2 SoC FPGA with Breakthrough Capabilities in Security, Reliability and Low



Microsemi Introduces Next-generation SmartFusion®2 SoC FPGA with Breakthrough
             Capabilities in Security, Reliability and Low Power

  PR Newswire

  ALISO VIEJO, California, Oct. 8, 2012

- Industry's Only Flash-based FPGA Targeted at Industrial, Defense, Aviation,
Communications and Medical Applications

ALISO VIEJO, California, Oct. 8, 2012 /PRNewswire/ -- Microsemi Corporation
(Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated
by power, security, reliability and performance, today unveiled its new
SmartFusion ^® 2 system-on-chip (SoC) field programmable gate array (FPGA)
family. Microsemi's next-generation SmartFusion2 SoC FPGAs are designed to
address fundamental requirements for advanced security, high reliability and
low power in critical industrial, defense, aviation, communications and
medical applications. SmartFusion2 integrates inherently reliable flash-based
FPGA fabric, a 166 megahertz (MHz) ARM ^® Cortex ^™ -M3 processor, advanced
security processing accelerators, DSP blocks, SRAM, eNVM and industry-required
high-performance communication interfaces all on a single chip.

(Logo: http://photos.prnewswire.com/prnh/20110909/MM66070LOGO )

"Several years ago we implemented a strategy to drive growth in high-value
markets by strengthening our product portfolio, increasing our focus on R&D,
and the strategic addition of key products and technologies for high-value,
high-barrier-to-entry markets," said James J. Peterson, president and CEO of
Microsemi. "Our new SmartFusion2 product family is one of the industry-leading
products we are developing to broaden our overall system solutions portfolio
and further solidify our leadership position in applications where security is
vital, reliability is non-negotiable and power is an essential factor."

"Our new SmartFusion2 SoC FPGAs are designed for challenging safety-critical
applications in industrial, defense, aviation, communications and medical
applications where it is imperative for devices to operate reliably and
flawlessly," said Esam Elashmawi, vice president and general manager at
Microsemi. "Our SmartFusion2 devices have the differentiated features required
to ensure secure and reliable operation with extremely low-power consumption.
These next-generation devices also feature higher densities and industry
standard interfaces that allow us to address a much wider range of mainstream
applications."

Microsemi has already engaged with lead customers who plan to use SmartFusion2
in a broad range of applications including flight data recorders, weapons
systems, defibrillators, handheld radios, communications management systems
and industrial motor control.

SmartFusion2: Design and Data Security

Recent attacks on industrial, defense, aviation, communications and medical
systems have highlighted the need for security and anti-tamper safeguards
within electronic systems. SmartFusion2 includes breakthrough security
capabilities that make it easy to protect classified and highly-valuable
designs against tampering, cloning, overbuilding, reverse engineering and
counterfeiting with state-of-the-art design protection based on non-volatile
flash technology.

SmartFusion2 provides the most advanced design and data security capabilities
starting with a robust root-of-trust device with secure key storage capability
using the SoC FPGA industry's only physically unclonable function (PUF) key
enrollment and regeneration capability. SmartFusion2 is also the only SoC FPGA
protected from differential power analysis (DPA) attacks using technology from
the Cryptographic Research Incorporated (CRI) portfolio. Users may also
leverage built-in cryptographic processing accelerators including: advanced
encryption standard (AES) AES-256, secure hash algorithm (SHA) SHA-256, 384
bit elliptical curve cryptographic (ECC) engine and a non-deterministic random
bit generator (NRBG).

The combination of these features, as well as the flash-based fabric, makes
SmartFusion2 the most secure FPGA available in the market.

SmartFusion2: High-reliability

Microsemi's programmable logic solutions are used extensively in defense and
aviation applications due to their high reliability and immunity to single
event upset (SEU) occurrences, which can cause binary bits to change state and
corrupt data and cause hardware malfunction. The need for SEU protection is
also extending into industrial and medical applications.

Smartfusion2 devices are designed to meet many industry standards including
IEC 61508, DO254 and DO178B, and feature SEU immunity of zero failures in time
(FIT). As an additional benefit, SmartFusion2 flash FPGA fabric does not
require external configuration, which provides an added level of security
since the SoC FPGA retains its configuration when powered off and enables
device "instant-on" performance.

SmartFusion2 is the only SoC FPGA that protects all its SoC embedded SRAM
memories from SEU errors. This is accomplished through the use of single error
correction, double error detection (SECDED) protection on embedded memories
such as the Cortex-M3 embedded scratch pad memory, Ethernet, CAN and USB
buffers, and is optional on the DDR memory controllers.

These product attributes, as well as the flash-based device architecture, make
SmartFusion2 the ideal solution for demanding applications such as aviation
that require protection from damaging SEU occurrences.

SmartFusion2: Lowest Power

SmartFusion2 SoC FPGAs offer designers 100x lower standby power compared to
equivalent SRAM-based FPGAs without sacrificing performance. The Flash*Freeze
standby power mode can be initiated with a simple command. In this mode all
registers and SRAM retain state, I/O state can be set, the microprocessor
sub-system (MSS) can be operational while low frequency clock and I/Os
associated with MSS peripherals can be operational. The device can enter and
exit Flash*Freeze mode in approximately 100 micro seconds. This is ideal for
low duty cycle applications where short bursts of activity are required, such
as defense radio where size, weight and power are critical.

SmartFusion2: Technical Information

Microsemi's flash-based SoC FPGA redefines low power with 10 milliwatts (mW)
of static power for 50K LUT (look-up table) device, including the processor
and without sacrificing performance. With the Flash*Freeze standby mode, power
drops to 1mW. This is about 100 times lower standby power than similar SoC
FPGAs or FPGAs.

SmartFusion2 devices are available with a range of density from 5K LUT to 120K
LUT plus embedded memory and multiple accumulate blocks for digital signal
processing (DSP). High bandwidth interfaces include PCI Express (PCIe) with
flexible 5G SERDES along with high-speed double data rate DDR2/DDR3 memory
controllers. The device also includes a microprocessor sub-system (MSS) with a
166 MHz ARM Cortex-M3 processor, on chip 64KB eSRAM and 512KB eNVM to minimize
total system cost. The MSS is enhanced with an embedded trace macrocell (ETM),
8 Kbyte instruction cache, and peripherals including controller area network
(CAN), Gigabit Ethernet and high speed USB 2.0. Optional security accelerators
can be used for data security applications.

Designing with SmartFusion2

System designers can leverage the newly released, easy-to-use Libero ^® SoC
software toolset for designing SmartFusion2 devices. Libero SoC integrates
industry leading synthesis, debug and DSP support from Synopsys, and
simulation from Mentor Graphics with power analysis, timing analysis and push
button design flow. Firmware development is fully integrated into Libero SoC
with compile and debug available from GNU, IAR and Keil, and all device
drivers and peripheral initialization is auto generated based on System
Builder selections. The ARM Cortex-M3 processor includes operating system
support for embedded Linux from EmCraft Systems, FreeRTOS, SAFERTOS and
uc/OS-III from Micrium.

Availability

Customers can start designing with SmartFusion2 M2S050T engineering sample now
with first production silicon slated for early 2013. For more information
about Microsemi's SmartFusion2 SoC FPGAs, visit www.microsemi.com/smartfusion2
or contact your local Microsemi sales representative.

About Microsemi

Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of
semiconductor and system solutions for communications, defense & security,
aerospace and industrial markets. Products include high-performance,
radiation-hardened and highly reliable analog mixed-signal integrated
circuits, FPGAs, SoCs and ASICs; power management products; timing and voice
processing devices; RF solutions; discrete components; security technologies
and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as
well as custom design capabilities and services. Microsemi is headquartered in
Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn
more at www.microsemi.com .

Editor's Note: Photos are available upon request by contacting Gwen Carlson at
949.380.6135 or gwen.carlson@microsemi.com .

Microsemi and the Microsemi logo are registered trademarks or service marks of
Microsemi Corporation and/or its affiliates. Third-party trademarks and
service marks mentioned herein are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of
1995: Any statements set forth in this news release that are not entirely
historical and factual in nature, including without limitation statements
related to its new SmartFusion2 product family, and its potential effects on
future business, are forward-looking statements. These forward-looking
statements are based on our current expectations and are inherently subject to
risks and uncertainties that could cause actual results to differ materially
from those expressed in the forward-looking statements. The potential risks
and uncertainties include, but are not limited to, such factors as rapidly
changing technology and product obsolescence, potential cost increases,
variations in customer order preferences, weakness or competitive pricing
environment of the marketplace, uncertain demand for and acceptance of the
company's products, adverse circumstances in any of our end markets, results
of in-process or planned development or marketing and promotional campaigns,
difficulties foreseeing future demand, potential non-realization of expected
orders or non-realization of backlog, product returns, product liability, and
other potential unexpected business and economic conditions or adverse changes
in current or expected industry conditions, difficulties and costs of
protecting patents and other proprietary rights, inventory obsolescence and
difficulties regarding customer qualification of products. In addition to
these factors and any other factors mentioned elsewhere in this news release,
the reader should refer as well to the factors, uncertainties or risks
identified in the company's most recent Form 10-K and all subsequent Form 10-Q
reports filed by Microsemi with the SEC. Additional risk factors may be
identified from time to time in Microsemi's future filings. The
forward-looking statements included in this release speak only as of the date
hereof, and Microsemi does not undertake any obligation to update these
forward-looking statements to reflect subsequent events or circumstances.

EDITORIAL CONTACTS: Gwen Carlson, Director of Corp. Communications
+1.949.380.6135 Email: gwen.carlson@microsemi.com

Website: http://www.microsemi.com
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