Renesas Electronics Announces Ultra-Low Power Consumption RH850/F1x Series Microcontrollers with On-Chip 40 nm Flash Memory for

  Renesas Electronics Announces Ultra-Low Power Consumption RH850/F1x Series
  Microcontrollers with On-Chip 40 nm Flash Memory for Automotive Body
  Applications

     Diverse Product Lineup Combines Ultra-Low Power Consumption and High
           Performance with Various Memory Size and Package Options

Business Wire

TOKYO -- September 27, 2012

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced
semiconductor solutions, today announced the RH850/F1x Series of 32-bit
microcontrollers (MCUs) for automotive body applications as the first products
to be released in the RH850 Family of automotive MCUs with on-chip flash
memory employing the industry’s most advanced 40 nanometer (nm) process.

RH850/F1x (Photo: Business Wire)

RH850/F1x (Photo: Business Wire)

The new MCUs are designed for use in a variety of automotive body applications
and provide many advantages. The RH850/F1x Series is comprised of three groups
and has a total of more than 50 products from Low-end to High-end, the
RH850/F1L, RH850/F1M and RH850/F1H. Larger on-chip flash memory capacity from
256KB up to 8MB is offered along with more compact package options (48-pin and
up). Dual-core versions are also planned to be available in the RH850/F1H
Group. The RH850/F1x Series uses the same architecture CPU core and common
peripheral functions, and has software compatibility within the same group.
The RH850/F1x Series uses the 40 nm process and metal oxide nitride oxide
silicon (MONOS) [Note 1] structure for flash memory with lower power
consumption (0.5 mA/MHz for RH850/F1L) and higher reliability. Renesas
improved automotive network functions (example: number of local interconnect
network (LIN) [Note 2] channels expanded to 18) and added data encryption
function with the RH850/F1x Series. These features will help customers build
electronic body control units combining energy efficiency, high performance,
and improved safety.

Reducing electric power consumption in vehicles is becoming an ever more
pressing issue. At the same time, automotive networks are becoming more
diverse and more complex, and the amount of data handled by electronic control
units is growing. As these networks begin to connect with access points
outside the vehicle, security measures become essential. In response to these
trends, automakers are working to develop platforms for electronic units to
enable them to build better cars more efficiently. The RH850/F1x Series
comprises a lineup of more than 50 products offering a variety of package
types, on-chip flash memory sizes, and peripheral function options. This broad
array of product is intended to meet a wide variety of requirements in the
automotive field.

Key Features of the RH850/F1x Series MCUs:

(1) Wide array of products for ample scalability

The RH850/F1x Series is made up of three groups from Low-end to High-end. All
the groups share the same CPU core architecture and the same selection of
peripheral functions, which allows common software to be used for different
system units and makes it easy to switch MCUs across groups. In addition, all
products in all groups incorporate power supply shutoff circuit technology for
reduced current consumption.

•RH850/F1L Group

The CPU core of G3 was designed to achieve lower power consumption and is
capable of operating at 80 MHz. It delivers performance of more than 2
DMIPS/MHz [Note 3] while maintaining low current consumption of 0.5 mA/MHz.
Available in a 48-pin QFP package that is even more compact than that of
comparable earlier Renesas products, this MCU enables customers to achieve
high-performance system control with a 32-bit CPU core even in units with
limited mounting space. It is ideal for applications such as air conditioner
control or LED headlight control.

•RH850/F1M Group (under development)

This MCU aims to combine high performance and power efficiency. Its core is
capable of operating at 120 MHz, and incorporates a floating-point arithmetic
unit. The available packages range from 100-pin to 208-pin, and the flash
memory capacity is selectable over a range from 1.5 MB to 4 MB. The RH850/F1M
is suitable for use in body control modules that require a large number of I/O
pins.

•RH850/F1H Group (under development)

This group uses a dual-core configuration to deliver the highest performance
in the RH850/F1x Series. The individual cores each have a maximum operating
frequency of 120 MHz and can share the on-chip peripheral functions. The
available packages extend up to a 276-pin BGA. Ethernet functionality is
included in addition to controller area network (CAN), LIN, and FlexRay [Note
4], allowing for complex control using data obtained from a variety of
automotive networks. An example application for the RH850/F1H would be as a
control MCU in a gateway module, and the adoption rate of such modules has
been increasing in recent years.

(2) On-chip flash memory combining low-power consumption and large capacity

The on-chip flash memory of the RH850/F1x Series employs the industry’s most
advanced 40 nm process and a MONOS Flash structure to achieve low-power
consumption and high reliability. The flash memory available for storing
instructions ranges across the series from 256 KB to 8 MB, allowing customers
to choose the optimal memory size for automotive system units ranging from
high-functionality to popularly priced versions. An independent flash memory
area is available for data storage, and it can be reprogrammed up to 125,000
times per 64-byte block. The ability to store data that previously would have
required external EEPROM reduces the number of external components required
and contributes to smaller board sizes.

(3) Additional new functions for security and diagnosis

An intelligent cryptographic unit (ICU) [Note 5] for data encryption has been
added to enable security functions needed in automotive units that are
increasingly adding network capabilities. These functions can provide
protection against alteration or theft of the system. Also, diagnostic
functions have been incorporated into the on-chip peripheral functions to
provide support for the ISO 26262 [Note 6] standard scheduled to be adopted by
the auto industry moving forward. For example, the A/D converter can be used
together with the on-chip self-diagnostic circuit to verify conversion
results. Additional ease-of-use is provided by an increase in the number of
channels that support monitoring for changes in digital or analog input
signals in low-power mode without the need to activate the CPU.

Development tools provided by Renesas for the RH850/F1x Series include the
Renesas eclipse embedded studio, e2studio and the E1 on-chip debugging
emulator, and flash memory programmers. There are also plans to provide
support for software conforming to the Automotive Open System Architecture
(AUTOSAR) standard.

[Note 1] MONOS (metal oxide nitride oxide silicon): Renesas has been using
MONOS technology in the on-chip flash memory of its EEPROM MCU products for
more than 20 years. MONOS flash memory using the 90 (nm) process, which is
used in MCUs of both the RX Family and SuperH Family, has a proven track
record in the industry.

[Note 2] LIN (local interconnect network): An automotive LAN communication
protocol.

[Note 3] DMIPS (Dhrystone MIPS (million instructions per second)): An
expression of the processing power of a computer as measured using the
Dhrystone performance measurement program.

[Note 4] FlexRay: An automotive LAN communication protocol.

[Note 5] ICU (intelligent cryptographic unit): An encryption circuit that
provides stronger security.

[Note 6] ISO 26262: A functional safety specification issued by the ISO as the
automotive version of the international standard titled Functional Safety of
Electrical/Electronic/Programmable Electronic Safety-related Systems (ISO
61508).

Refer to the separate sheet for the main specifications of the RH850/F1x
Series of MCUs.

Pricing and Availability

Samples of the RH850/F1L Group of MCUs are scheduled to be available from 2Q
CY2013, priced at US$30 per unit. Mass production of the RH850/F1L Group is
scheduled to begin in FY2014, with the different product versions appearing
soon after, and is expected to reach a scale of 3,000,000 units for each
version per month by June 2015. (Pricing and availability are subject to
change without notice.)

(Remarks)

All other registered trademarks or trademarks are the property of their
respective owners.

About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723), the world’s number one supplier
of microcontrollers, is a premier supplier of advanced semiconductor solutions
including microcontrollers, SoC solutions and a broad-range of analog and
power devices. Business operations began as Renesas Electronics in April 2010
through the integration of NEC Electronics Corporation (TSE:6723) and Renesas
Technology Corp., with operations spanning research, development, design and
manufacturing for a wide range of applications. Headquartered in Japan,
Renesas Electronics has subsidiaries in 20 countries worldwide. More
information can be found at www.renesas.com.

Separate Sheet

Product Specifications of the RH850/F1x Series of MCUs

Item             Specifications (Tentative)
                 RH850/F1L Group         RH850/F1M Group       RH850/F1H Group
Pin count        48,64,80,100,144,176    100,144,176,208(*)    176,208(*),272(*)
(Pins)
Code flash       256K to 2M              1.5M to 4M            3M to 8M
(Byte)
Data flash       32K                     64K                   64K or 128K
(Byte)
CPU core         G3                                               G3 x 2ch
Maximum CPU                                                             120M
operation        80M                     120M                  (Each core)
speed(Hz)
External         1 unit
memory I/F
Internal         yes
oscillator
Timer
Timer Array
Unit             up to 3 units (16ch/unit)
(16-bit)
Timer Array
Unit             up to 2 units (4ch/unit)
(32-bit)
Real time        1ch
clock
Watchdogtimer    up to 2ch                                        up to 3ch
Encoder Timer    1ch
Serial I/F
CAN              up to 6ch                                        up to 7ch
CSI              up to 6ch                                        up to 8ch
UART/LIN         up to 16ch                                       up to 18ch
I2C              1ch
FlexRay          -                       1ch
Ethernet         -                       -                     1ch
Other functions
A/D converter    up to 60ch              up to 72ch
DMA              up to 16ch                                       up to 32ch
Motor control    1 unit
PWM diagnosis    up to 72                up to 80              up to 96
Security         yes
functions
*: BGA package. Other packages are QFP.


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Contact:

Japan
Renesas Electronics Corporation
Ai Kanehira, + 81-3-6756-5555
ai.kanehira.xw@renesas.com
 
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